Hardware Technical Specification 5 Chapter Hardware Specifications You can enjoy and utilize the Eee PC 4G (701) Notebook more effectively with a better comprehension of detailed hardware specifications of the notebook. T his chapter lists the detailed specifications of the notebook’s main system and modules. Please refer to this section when you need to find out specific technical data about the notebook.
Hardware Technical Specification LIST OF FIGURES 1 MARKETING SPEC Eee PC 4G (701) Specification Product Family CPU Type Speed Package L2 Cache Size Memory Type Base Memory Expansion Memory MAX LCD Size EEE PC 4G (701) Intel Celeron-M-ULV FCBGA 479 512 KB None 256/512MB/1GB 7” Interface LVDS Contrast Control None Chip Set Hot-key Onboard / Flash Module Yes Onboard 4G / Flash Module 16G Intel Sonoma Platform North Bridge Intel 910GML/910GMLE South Bridge Intel ICH6-M Super IO SO-DIMM x 1
Hardware Technical Specification Flash ROM (SPI) Graphic Accelerator 3D Controller SST/Winbond/MXIC Intel 910GML internal GPU Yes Intel Internal graphic AGP Support No Dual view/Dual App Yes Graphic Memory TV Out Support 4Mbits Share Memory No Sound System Controller Realtek ALC662 SW wave table Yes FM synthesizer Yes Speaker Stereo I/F Azalia PC99 S/PDIF 6 channel output Audio Amplifier Microphone Modem Controller Spec I/F Yes None Yes TPA6017A2PWP Mono CONEXANT CONEXANT 56K Azalia MDC
Hardware Technical Specification Controller Atheros L2 Internal Keyboard Key Function Key Hot Key Function 80 Keys (W/ MS-Windows function keys) 12 Function Keys 13 Hot Keys Suspend (STR or STD) Fn + F1 Wi-Fi enable Fn + F2 Application manager Fn + F6 Brightness Up Fn + F4 Brightness Down Fn + F3 LCD/CRT Fn + F5 PC Speaker Volume Fn + F7 On/Mute PC Speaker Volume Fn + F9 Volume increase PC Speaker Volume Fn + F8 Volume decrease Number Lock Fn + F11 Scroll Lock Fn + F12 Print s
Hardware Technical Specification Glide Pad Yes Right Button Yes Left Button Yes Scroll Yes Function Control Power On Button Yes LCD Brightness Yes LCD Lid Switch Yes Sound Volume Yes Password Override Reset/Force Off I/O Port Hot Keys Hot Keys Yes (Master Password) Yes (Reset switch) All ports support hot-plug Parallel N/A CRT Yes Mouse/Keyboard N/A IrDA Port N/A Fax/Modem Yes RJ11 LAN Jack Yes RJ45 Line In Jack N/A Mic In Jack Yes Head Phone Jack Yes Stereo out USB
Hardware Technical Specification 1st Battery 新力盛 Charging time Li-ION (5200mAH) Machine ON TBD. Machine OFF TBD. Battery Life TBD. PM Off TBD. PM On TBD. Power Management AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.
Hardware Technical Specification 2 CHIPSET LIST Chipset Summary Table Function EEE PC 4G (701) HW ACPI/PC99 Intel Dothan Not required 512KB Not required North Bridge Intel 910GML/910GMLE YES South Bridge Intel ICH6-M YES MEMORY DDR II SDRAM Not required BIOS ROM SST/Winbond/MXIC 4Mb Not required Intel internal graphic YES CPU SRAM (L2 Cache) VGA SUPER I/O N/A PCMCIA N/A AUDIO Azalia CODEC YES AUDIO AMPLIFIER TPA6017A2PWP Not required KB CONTROLLER ENE KB3310 YES IrDA
Hardware Technical Specification 2.1 CPU Processor Type: Intel Dothan Processor Intel Celeron-M ULV 353 Processor frequency: 900MHz (normal run 630MHz) Construction method: FCBGA479 Supply voltage: Core:0.85V(High_Frequency_Mode)~0.75V(lowest_Frequen cy_Mode) Function feature: On-die , primary 32-KB instruction cache and 32-KB writeback data cache. On-die , 512KB second level cache with Advanced Transfer Cache Architecture. Data Prefetch. Streaming SIMD extensions 2(SSE2). 400 MHZ FSB support 2.
Hardware Technical Specification 2.2.2 Vendor: Intel Parts Number: 910GML/910GMLE Package: 1257-ball micro-FCBGA South Bridge Function: DMI x2/x4 interface link with GMCH Integrated PC/AT compatible system (DMA Controller, INT, Timer/Counters) Integrated one channels DMA/33/66/100 support IDE controller with Ultra Integrated USB 1.1 and 2.0 Host Bus controller with 8 USB ports Integrated HD Audio Interface Build-in RTC LPC Interface 2.3 2.3.
Hardware Technical Specification 2.3.2 EXPANSION MEMORY Number of sockets: Bus: Supply voltage: One 200 pin SO-DIMM slot 64-bit data path 1.8V Functional features: 2.4 Hardware features: Supports up to 16 simultaneous open pages Supports DDR2 400 DDR devices Maximum of 2GB of system memory Parity support: without ECC BIOS ROM ROM Type: SST/Winbond/MXIC Flash Memory Package: 8-lead SOIC Supply voltage: 3.3V Serviceability: End user upgradeable for the firmware 2.
Hardware Technical Specification 2.6 KEYBOARD CONTROLLER Function features: Embedded controller-style host Support hardware speed-up of GateA20 and RC Local 18x8 keyboard switch matrix support Three industry standard serial keyboard interfaces All three ports are bi-directional Vendor: Parts Number: Package: 2.7 KB3310 128-pin LQFP AUDIO CODEC Vendor: Realtek Parts Number: ALC662 Package: 2.8 ENE 48-pin LQFP AUDIO AMPLIFIER Function features: Max 1.
Hardware Technical Specification 2.9 2.9.1 LAN & MODEM LAN Function features: Scatter and gather transmit receive DMA Interrupt coalescing 10Mb/s, 100Mb/s, operation Compliant to ACPI 2.0 specification Compliant to IEEE 802.3u Auto-Negotiation Support Wake-on-LAN function and remote wake up (Magic Internal transmit and receive FIFO(2KB*2) Vendor: Parts Number: Package: 2.9.2 Atheros L2 64-Pin LQFP MODEM Function features: V.
Hardware Technical Specification 3 KEY PARTS LIST Key Parts Summary: 3.1 Display WVGA Technology: VGA+ Active color (TFT: Thin Film Transistor) Size: 7”W Resolution: WVGA (800 X 480) Dimension: 164mm(H) * 103mm(V) * 5.1mm(T) Pixel Pitch: 0.1905mm * 0.1905mm Display Colors: 16M Colors Vendor: AUO Technology: N/A Size: Resolution: Dimension: Pixel Pitch: Display Colors: Vendor: 3.2 Touch Pad Dimensions: 47.8(W) x31.9(H) x 0.85(T) (Unit: mm) Sensor Effective Areas: 35.5 (W) x 28.
Hardware Technical Specification Vendor/Model 3.3 Synaptics : SYNAPTICS/TM-01058-002 Keyboard Function Feature: Standard Notebook-Keyboard Hardware Feature: Simultaneously use of internal and external keyboard Easily to assemble or disassemble 3.4 3.4.1 Compatibility: MS-Windows 2000/ XP Dimensions: 211.70 (H) x 80.70 (V) (Unit: mm) Type: Key switch membrane Total Travel: 1.5 +/- 0.
Hardware Technical Specification 3.4.2 RTC Backup Battery Purpose: Backup the RTC/CMOS data While AC adapter off & Main Battery removed 3.5 Chemistry: Coin cell 2032 Li-ion battery Voltage: Nominal 3V Capacity: 200mAH Vendor: KTS AC/DC Adapter The notebook can be powered either by an external AC adapter or by an internal battery pack. The AC adapter is used as power source for the DC/DC converter and as constant current source for the battery pack.
Hardware Technical Specification 4 SYSTEM 4.1 System diagram 4.
Hardware Technical Specification 4.3 4.3.1 4.3.
Hardware Technical Specification 4.3.3 PCI INT Map N/A 4.3.4 PCI Bus Master Map N/A 4.3.
Hardware Technical Specification 5 I/O PORT PIN ASSIGNMENT No FUNCTION CRT DESCRIPTION Display (Analog) Flash module LCD KEYBOARD TOUCHPAD&LED 1ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .USB Universal Serial Bus LAN & Modem .Card Reader Universal Serial Bus .
Hardware Technical Specification 5.1 CRT Vendor Part No. Pin No. ALLTOP C10511-11505-B 15 Pin (DIP) No Pin Assignment (by: sort) 1 RED Video (analog) Description Red this DAC analog output drives the CRT interface. 2 GREEN Video (analog) Green this DAC analog output drives the CRT interface. 3 BLUE Video (analog) Blue this DAC analog output drives the CRT interface.
Hardware Technical Specification 5.2 Flash module pin assignment Vendor Part No. Pin No. 52 Pin (DIP) Pin No. Pin No. 1. IDE_DD0 2. IDE_DD15 3. IDE_DD1 4. GND 5. IDE_DD2 6. IDE_DD14 7. IDE_DD3 8. IDE_DD13 9. GND 10. IDE_DD12 11. IDE_DD4 12. IDE_DD11 13. IDE_DD5 14. IDE_DD10 15. GND 16. IDE_DD9 17. IDE_DD6 18. GND 19. IDE_DD7 20. IDE_DD8 21. GND 22. IDE_RST#1 23. S_SATA_RXN0 24. IDE_DIOW# 25. S_SATA_RXP0 26. IDE_PCSEL#1 27. GND 28. IDE_DIOR# 29. GND 30. IDE_DDACK# 31.
Hardware Technical Specification 5.3 LCD pin assignment Vendor Part No. Pin No. I-PEXV WTOB_CON_20P 20 Pin (SMD) No.
Hardware Technical Specification 5.4 Internal keyboard pin assignment Vendor Part No. Pin No.
Hardware Technical Specification 28 NC_KSO16 O *** 5.5 Internal Touch Pad & LED Pin assignment Vendor Part No. Pin No.
Hardware Technical Specification 5.6 1ST Battery pin assignment No Signal Description 1 BAT_IN# 2 BAT I 3 BAT I 4 BAT_ID O 5 GND 6 BAT_TS 7 P Ground P O O BAT_CONFIG 8 NC NC 9 5.7 Power Type Ground GND P DC in Jack pin assignment Vendor Part No. Pin No.
Hardware Technical Specification 5.8 Audio Jack 5.8.1 Internal Speaker Jack Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Type 1 INTSPKR- Internal speaker signal right channel negative O 2 INTSPKR+ Internal speaker signal right channel positive O 3 INTSPKL- Internal speaker signal left channel negative O 4 INTSPKL+ Internal speaker signal left channel positive O 5.8.2 Headphone Jack Vendor Part No. Pin No.
Hardware Technical Specification 5.8.3 Microphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Type 1 GND_AUDIO Ground 2 MIC1_JACK_L External microphone input I/O 3 MIC1_JACK_R External microphone input I/O 4 GND_AUDIO Ground P 5 MIC_SW# Control internal MIC O 6 NC NC 5.9 P NC Fan Pin Assignment Vendor Part No. Pin No.
Hardware Technical Specification 4 None None NC 5 GND Ground P 6 +3VAUX_MDC 3.3V power turned off during S4 P 7 ACZ_SYNC_MDC Azalia sync signal I 8 GND P 9 ACZ_SDIN1_MD Azalia data input signal C O 10 GND P 11 ACZ_RST#_MDC Azalia reset signal _R I 12 ACZ_BCLK_MDC Azalia bit clock signal I Ground Ground 5.11 USB pin assignment Vendor Part No. Pin No.
Hardware Technical Specification SUYIN USB_CON_1X4P No 4 Pin (SMD) Signal Description Type 1 +5V_USB34_CON USB 5V power P 2 USBPN3 USB port 3 negative signal I/O 3 USBPP3 USB port 3 positive signal I/O 4 GND USB 5V ground P 5.12 LAN & Modem pin assignment Vendor Part No. Pin No.
Hardware Technical Specification 5.13 Card Reader pin assignment Vendor Part No. PANASONIC SD_SOCKET_9P Pin No Signal 1. UB_SD_DATA3 2. UB_SD_CMD 3 GND 4 +3V_SD 5 UB_SD_CLK 6 GND 7 UB_SD_DATA0 8 UB_SD_DATA1 9 UB_SD_DATA2 Pin No.
Hardware Technical Specification 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin +12V VSUS_ON Other Control +5V SUSB_ON LCD, Flash, Flash & Wlan LED, Fan, Camera, Codec, Audio, SB +3V SUSB_ON NB IO, SB, LCD, Card reader, Codec, Audio +1.8V_DUAL SUSC_ON NB, DDR2 power +5VSB VSUS_ON SB, USB, Charge & Power LED +3VSB VSUS_ON SB, Audio, Clock Generator, PCIE interface +1.5V SB Core, NB Core +2.
Hardware Technical Specification clock (SUSCLK) in this suspend mode to support refresh of these memory subsystems. Only an enabled “resume event” can bring the platform out of the suspend to RAM (STR) state. 6.2.5 Suspend to disk mode (STD) A suspend state where the context of the entire system is saved to disk, all motherboard components are powered-off, and all clocks are stopped. Any enabled “resume event”, such as Power switch or RTC, can bring the platform out of the suspend to disk (STD) state.
Hardware Technical Specification 6.3.1 Lid switch Display mode State Lid close Lid open LCD Full on LCD OFF No action Stand by LCD OFF No action STR/STD LCD OFF No action Full on No action No action Stand by No action No action STR/STD No action No action Full on LCD OFF/CRT ON No action Stand by No action No action STR/STD No action No action CRT SIMUL LCD display will be shut down while closing LCD. 6.3.
Hardware Technical Specification Modem ON Power down Power Off Power Off WLAN ON Power down Power Off Power Off 6.4.
Hardware Technical Specification 6.4.
Hardware Technical Specification 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the following PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (FCBGA 479) Main Board Main System board Inverter Board LCD Module Back-light TOUCH PAD&AUDIO DJ 4 LED Indicators, 2 Touch Pad Button, 5 Audio DJ BOARD button 7.2 SO-DIMM Module Memory Expansion Modem Board MDC Processor Feature: Celeron M CPU with on-die L2 cache.
Hardware Technical Specification 7.3 7.3.
Hardware Technical Specification 7.3.2 DC/DC module spec Controller: ISL6262CRZ, TPS51020, ISL6227CAZ, Input voltage: 8-20V Output voltage/current: Voltage Current Regulation +3VA 60mA +-5% +3VSB 1.74A +-5% +5VSB 1.38A +-5% +1.5V 1.88A +-5% +5V 1.09A +-5% +3V 566Ma +-5% +2.5V 100mA +-5% +1.8V_DUAL 4.5A +-5% VTT_DDR 121mA +-5% +VCCP 2.07A +-5% VCORE 2.96A +-5% Support OVP Support OCP 7.3.3 Charger Charger spec Controller: MAX8724ETI Input voltage: 9.
Hardware Technical Specification Charge current (4S2P) 2.4A 2.46A 2.6A Charge current (4S1P) 1.3A 1.4A 1.5A Ripple & Noise 100mV Efficiency 94% 7.
Hardware Technical Specification 7.5.3 Protection OVP: 24V(max) SCP: Yes OCP: 19V/5A(max) 7.6 Main Battery spec Battery pack capacity: Li-Ion Vendor Cells Voltage Capacity 新力盛 4 7.4V 2600mAh Watts Battery warning and low percentage (Li-Ion): Battery low = 7% Battery low low= 0% Gauge controller (BQ2060H) setting: Charging voltage:8.36V Charging efficiency: 95% Low temperature capacity: 70% 7.7 LAN Spec Controller: Atheros L2 Interface: PCIE Compliant to PCI 2.
Hardware Technical Specification 7.8 Modem spec Part Number: ASUS RD01-D480 Controller: Conexant software modem Interface: AC-link Support Caller ID Support Ring wake up function ITU-T V.90 Data Mode with auto-fall back to K56flex and V.34 V.80 Video ready Modem Data speed: 56Kbps FAX transfer speed: 14.4Kbps Modem modulation format: V.
Hardware Technical Specification 8 8.
Hardware Technical Specification 8.2 Power cord list Where TBD Description Vendor US UK Japan Europe Austria South Asia 8.3 Safety/ EMI Appliance : Agency Approval EMC CE Mark (Europe) BSMI (Taiwan) EMI FCC Class B Certified (USA & Canada), VCCI (Japan) MIC, IDA Other Requirements Safety UL, CSA or CUL, NEMKO-CB (Norway), TUV, CE Mark (Europe) Telecomm.
