User Manual

Report No. ASL23051710
48 - 95
Universal Standard Service, Inc.
Ambient
24.8
60.0
24.8
25.0
--
PCB near CPU
65.0
100.2
65.0
65.2
105/104
RTC battery body
54.5
89.7
54.5
54.7
100/80
Memory module body (Plastic)
--
--
64.3
64.5
--/87
2.5” SSD body (Metal)
--
--
52.0
52.2
--/70
M.2 SSD body (Plastic)
--
--
65.0
65.2
--/87
nano SIM card cover (Metal)
--
--
73.6
73.8
--
Wireless card body (Metal)
--
--
65.9
66.1
--/70
LTE module body (Metal)
--
--
70.4
70.6
--
Enclosure outside near CPU (Metal)
--
--
47.3
47.5
--/70
Enclosure outside near 2.5” SSD (Metal)
--
--
44.1
44.3
--/70
Terminal block body (Plastic)
--
--
31.2
31.4
--/87
Normal condition
Motherboard: MB1, Supplied by DC power source
For verifying the temperature limit after power off
with 3mins. (As reasonable dismantling time)
--
--
Condition
2
(Original)
Condition
2 (Shift to
25)
Touch
temperatur
e (TS2)
Ambient
--
--
24.8
25.0
--
nano SIM card cover (Metal)
--
--
58.8
59.0
70
LTE module body (Metal)
--
--
59.3
59.5
70
Normal condition
Motherboard: MB1, Supplied by DC power source
Condition
3
(Original)
Condition
3 (Shift to
60)
Condition
3
(Original)
Condition
3 (Shift to
25)
Compone
nt /Touch
temperatur
e (TS2)
Ambient
24.6
60.0
24.6
25.0
--
PCB near CPU
60.7
96.1
60.7
61.1
105/104
RTC battery body
47.5
82.9
47.5
47.9
100/80
Memory module body (Plastic)
--
--
58.4
58.8
--/87
2.5” SSD body (Metal)
--
--
47.5
47.9
--/70
M.2 SSD body (Plastic)
--
--
58.8
59.2
--/87
nano SIM card cover (Metal)
--
--
68.7
69.1
--/70
Wireless card body (Metal)
--
--
59.4
59.8
--/70
LTE module body (Metal)
--
--
66.4
66.8
--/70
Enclosure outside near CPU (Metal)
--
--
43.4
43.8
--/70
Enclosure outside near 2.5” SSD (Metal)
--
--
36.5
36.9
--/70
Terminal block body (Plastic)
--
--
31.7
32.1
--/87
Normal condition
Motherboard: MB1, Supplied by DC power source
Condition
4
(Original)
Condition
4 (Shift to
60)
Condition
4
(Original)
Condition
4 (Shift to
25)
Compone
nt /Touch
temperatur