User Manual

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Table of Contents
1 Product Description ............................................................................................... 15
1.1 Overview ...................................................................................................................................................... 15
1.1.1 Summary of Mini PC SKUs ................................................................................................. 15
1.1.2 Summary of Standard Kit and Board SKUs .................................................................. 15
1.1.3 Summary of Embedded Kit and Board SKUs .............................................................. 16
1.1.4 Feature Summary Kits .......................................................................................................... 17
2 Product Layout ........................................................................................................ 21
2.1 Board Layout .............................................................................................................................................. 21
2.1.1 Board Layout (Bottom) ........................................................................................................ 21
2.1.2 Board Layout (Top) ............................................................................................................... 23
2.1.3 Front Panel ............................................................................................................................... 24
2.1.4 Back Panel ................................................................................................................................ 24
2.1.5 Chassis Expandability Options ......................................................................................... 25
2.1.6 Block Diagram ......................................................................................................................... 26
3 Feature Descriptions ............................................................................................. 27
3.1 Graphics Subsystem ................................................................................................................................ 27
3.1.1 Intel® Iris® Xe Graphics ..................................................................................................... 27
3.1.2 Display Emulation .................................................................................................................. 28
3.2 SATA Interface ........................................................................................................................................... 29
3.3 Real-Time Clock Subsystem ................................................................................................................ 29
3.4 LAN Subsystem ......................................................................................................................................... 30
3.4.1 RJ-45 LAN Connector with Integrated LEDs ............................................................. 30
3.5 Hardware Management Subsystem .................................................................................................. 30
3.5.1 Fan Monitoring ....................................................................................................................... 30
3.5.2 System States and Power States ...................................................................................... 30
4 Technical Reference .............................................................................................. 33
4.1 Connectors and Headers ...................................................................................................................... 33
4.1.1 Signal Tables for the Connectors and Headers .......................................................... 33
4.2 Mechanical Considerations .................................................................................................................. 43
4.2.1 Chassis Images ........................................................................................................................ 43
4.2.2 Form Factor .............................................................................................................................. 45
4.3 Thermal Considerations ......................................................................................................................... 46
4.4 Reliability ...................................................................................................................................................... 47
4.5 Environmental............................................................................................................................................ 47
5 Overview of BIOS Features .................................................................................. 49
5.1 Introduction ................................................................................................................................................ 49
5.2 BIOS Updates ............................................................................................................................................ 49