User Manual

xi
Table of Contents
1 Product Description ................................................................................................... 15
1.1 Overview ................................................................................................................................................................ 15
1.1.1 Summary of Mini PC SKUs ........................................................................................................ 15
1.1.2 Summary of Standard Kit and Board SKUs ....................................................................... 15
1.1.3 Summary of Embedded Kit and Board SKUs .................................................................. 16
1.1.4 Feature Summary Kits ................................................................................................................. 17
2 Product Layout ............................................................................................................ 20
2.1 Board Layout ..................................................................................................................................................... 20
2.1.1 Board Layout (Bottom) ............................................................................................................. 20
2.1.2 Board Layout (Top) ...................................................................................................................... 22
2.1.3 Front Panel ...................................................................................................................................... 23
2.1.4 Back Panel........................................................................................................................................ 23
2.1.5 Chassis Expandability Options .............................................................................................. 24
2.1.6 Block Diagram ................................................................................................................................ 25
3 Feature Descriptions .................................................................................................. 26
3.1 Graphics Subsystem ....................................................................................................................................... 26
3.1.1 Intel® Iris® Xe Graphics ........................................................................................................... 26
3.1.2 Intel® UHD Graphics for 13
th
Gen Intel Processors..................................................... 27
3.1.3 Display Emulation ......................................................................................................................... 27
3.2 SATA Interface................................................................................................................................................... 28
3.3 Real-Time Clock Subsystem ....................................................................................................................... 28
3.4 LAN Subsystem ................................................................................................................................................. 29
3.4.1 RJ-45 LAN Connector with Integrated LEDs ................................................................ 29
3.5 Hardware Management Subsystem ....................................................................................................... 29
3.5.1 Fan Monitoring .............................................................................................................................. 29
3.5.2 System States and Power States ........................................................................................... 29
4 Technical Reference .................................................................................................... 31
4.1 Connectors and Headers .............................................................................................................................. 31
4.1.1 Signal Tables for the Connectors and Headers .............................................................. 31
4.2 Mechanical Considerations ......................................................................................................................... 41
4.2.1 Chassis Images ................................................................................................................................ 41
4.2.2 Form Factor ..................................................................................................................................... 43
4.3 Thermal Considerations ................................................................................................................................ 44
4.4 Reliability .............................................................................................................................................................. 45
4.5 Environmental ................................................................................................................................................... 45
5 Overview of BIOS Features ...................................................................................... 47
5.1 Introduction ........................................................................................................................................................ 47
5.2 BIOS Updates .................................................................................................................................................... 47