Assembly Instructions
AN2009-01
Application Note 4 V2.2, 2015-02
Table of Contents
1 General Information .......................................................................................................................... 5
1.1 General Information on power module handling ................................................................................. 6
2 Requirements for Printed Circuit Boards ....................................................................................... 7
3 The Press-In Process ........................................................................................................................ 9
3.1 Press-In Tools ................................................................................................................................... 10
3.2 Press-In Forces ................................................................................................................................. 10
4 The Press-Out Process ................................................................................................................... 11
4.1 Press-Out Tools ................................................................................................................................ 11
4.2 Press-Out Forces .............................................................................................................................. 12
5 Quality of PressFIT Contacts ......................................................................................................... 13
6 Mounting a PCB to the Module ...................................................................................................... 15
7 Condition of the Heat Sink for Module Assembly ........................................................................ 16
8 Applying the Thermal Grease ........................................................................................................ 17
9 Assembling the Module on the Heat sink ..................................................................................... 18
10 System Considerations .................................................................................................................. 20
10.1 Module is already pressed into the printed circuit board before mounting ....................................... 20
10.2 Module is pressed into the printed circuit board after mounting ....................................................... 20
11 Clearance and creepage distances ............................................................................................... 21
12 Multi-Module and Automotive Application ................................................................................... 22
12.1 Modules press-in into the PCB .......................................................................................................... 22
12.2 Modules and PCB mounting on the heat sink ................................................................................... 24
13 Storage and Transport .................................................................................................................... 27
14 Climatic conditions during active, current carrying operation of EasyPIM™ and EasyPACK
Modules ............................................................................................................................................ 28