Assembly Instructions
AN2009-01
Quality of PressFIT Contacts
Application Note 13 V2.2, 2015-02
5 Quality of PressFIT Contacts
PressFIT is an alternative solution for connecting control and load current contacts on IGBT modules
with a printed circuit board.
The requirements for greater durability, the trend towards higher temperatures and absence of lead
and – of course – very simple handling are continuously growing.
The PressFIT technology makes it possible for the first time to improve reliability up to a factor of 100
compared to manually soldered contacts and other contact types. The results of the reliability analyses
in the Siemens norm SN 29500-5 demonstrate the factor.
The assembly process is simple and consequently saves time and money. The process is reliable and
system reparability is ensured.
An extract from the Siemens Norm SN 29500-5 / Edition 2004-06 Part 5 shown in Table 2 illustrates the
failure rates of different contact technologies.
Table 2: Failure rates for various contact technologies Siemens Norm SN 29500-5 / Edition
2004-06 Part 5
Process
Conductor
diameter
in mm²
Failure rate
λ
ref
in FIT
1)
Notes:
Standards/guidelines
Solder manual
automatic
–
0.5
0.03
IPC 610
2)
, class 2
Wire bonding for hybrid circuits Al
Au
0.1
0.1
28 µm / wedge bond
25 µm / ball bond
Winding
0.05 to 0.5
0.002
DIN EN 60352 – 1 /
IEC 60352 – 1 CORR1
Crimping manual
automatic
0.05 to 300
0.25
DIN EN 60352 – 2 /
IEC 60352 – 2 A 1+2
Clips
0.1 to 0.5
0.02
DIN 41611 – 4
PressFIT
0.3 to 2
0.005
IEC 60352 – 5
Insulation piercing connectors
0.05 to 1
0.25
IEC 60352 – 3 / IEC 60352 – 4
Screws
0.5 to 16
0.5
DIN EN 60999 – 1
Terminals (spring force)
0.5 to 16
0.5
DIN EN 60999 – 1
1) 1 FIT = 1 x 10
-9
1/h; (one failure per 10
9
component hours)
2) Acceptance conditions for printed circuit boards
The PressFIT contact has been qualified in accordance with the usual standards for IGBT modules at
Infineon.