Product manual

Configuration directions, Limitations of the system
Technical Product Manual - DCT1800-GAP
TD 92093 (1/LZBNB 103 108 R4D) / 2006-03-09/ Ver.C
© 2006
7
2.3 Modular cabinet temperature limitations
Due to the heat generated by the LTU board ROFNB 157 25/2, a maximum of 7 LTUs
1
can be placed
in one modular cabinet if all the three following conditions are fulfilled:
• Traffic generated (load) by the cordless phones on an LTU is less than 4 Erlang (only 4 LTCs on
an LTU board are simultaneously in use)
• PBX/Centrex line current on a/b wire is ≤ 55 mA or PBX/Centrex line (a/b) resistance is
750 Ω or more. These values are specified in the ETSI standard TR 101 188 V1.1.1 (March ’99).
• Modular cabinet placed in room with ambient temperature of 40°C
Board type Product code board +5 V +12 V −12 V
CPU2 2/ROFNB 157 26/1 6 W
CLU ROFNB 157 11/n) 3.6 W
CLU-S ROFNB 157 16/2 2.25 W
SLU ROFNB 157 16/1 4.5 W
SPU-S ROFNB 157 16/3 2.25 W
DTU 2/ROFNB 157 13/n 4.5 W
LTU ROFNB 157 02/n, ROFNB 157 04/n 2.5 W 1.6 W 0.8 W
LTU ROFNB 157 25/n 2 W
SPU ROFNB 157 08/n* 3.5 W
Table 1 Power consumption per board
1. Distribute the LTUs over the modular cabinets if possible