Specifications

Signals on Pads

GPIO 3 GP3[2] General Purpose I/O B 4 AL6

GPIO 3 GP3[3] General Purpose I/O B 4 AK9

GPIO 3 GP3[4] General Purpose I/O B 4 AM6

GPIO 3 GP3[5] General Purpose I/O B 4 AH10

GPIO 3 GP3[6] General Purpose I/O B 4 AN6

GPIO 3 GP3[7] General Purpose I/O B 4 AJ10

JTAG nBSTAPEN Boundary Scan TAP Select IPU - C21

JTAG nTRST Test Reset IPU - D21

JTAG RTCK Sync of Multi-ICE TCK O 8 A21

JTAG TCK Test Clock I - A22

JTAG TDI Boundary Scan Input IPU - G19

JTAG TDO Boundary Scan Output T 8 B21

JTAG TMS Test Mode Select IPU - E20

Miscellaneous BIGENDOUT Byte Endian Mode or TESTACK O 4 G7

Miscellaneous CONFIGINIT Chip configuration I - E8

Miscellaneous nCONFIGCLR Chip configuration reset I - E6

Miscellaneous nPORESET Power On Reset I - D5

Miscellaneous nRESET AMBA AHB Reset I - E7

Miscellaneous SCANENABLE Scan Enable I - AJ4

Miscellaneous TESTSELECT Manufacturing Test Select I - H6

MPMC MPMCADDR[0] Address bus O 12 Y3

MPMC MPMCADDR[1] Address bus O 12 Y4

MPMC MPMCADDR[2] Address bus O 12 AA5

MPMC MPMCADDR[3] Address bus O 12 AA2

MPMC MPMCADDR[4] Address bus O 12 AA3

Table A-1 Pad signals (continued)

Function Signal Description Type Drive BGA