Data Sheet
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Block Diagram
- 2. Pinout
- 3. I/O Multiplexing and Considerations
- 4. Electrical Characteristics
- 4.1. Disclaimer
- 4.2. Absolute Maximum Ratings
- 4.3. General Operating Ratings
- 4.4. Power Considerations
- 4.5. Power Consumption
- 4.6. Peripherals Power Consumption
- 4.7. BOD and POR Characteristics
- 4.8. External Reset Characteristics
- 4.9. Oscillators and Clocks
- 4.10. I/O Pin Characteristics
- 4.11. USART
- 4.12. SPI
- 4.13. TWI
- 4.14. VREF
- 4.15. ADC
- 4.16. AC
- 4.17. UPDI Timing
- 4.18. Programming Time
- 5. Typical Characteristics
- 6. Ordering Information
- 7. Online Package Drawings
- 8. Package Drawings
- 9. Conventions
- 10. Data Sheet Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
8. Package Drawings
8.1 48-Pin TQFP
C
SEATING
PLANE
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
TOP VIEW
EE1
D
0.20 H A-B D
4X
D1
2
1 2
A B
AA
D
D1
A1
A
H
0.10 C
0.08
C
SIDE VIEW
N
0.20 C A-B D
48X TIPS
E1
4
D1
4
A2
E1
2
e
48x b
0.08 C A-B D
NOTE 1
ATmega809/1609/3209/4809 – 48-pin
Package Drawings
© 2019 Microchip Technology Inc.
Datasheet Preliminary
DS40002016B-page 69