Data Sheet

...........continued
Symbol Description Condition Min. Typ. Max. Unit
f
CAL
Frequency calibration range OSC16M
(2)
14.5 17.5 MHz
OSC20M
(2)
18.5 21.5 MHz
E
TOTAL
Total error with 16 MHz and 20
MHz frequency selection
From target
frequency
T
A
=25°C, 3.0V -1.5 1.5 %
T
A
=[0, 70]°C,
V
DD
=[1.8, 3.6]V
-2.0 2.0 %
Full operation
range
-4.0 4.0
E
DRIFT
Accuracy with 16 MHz and 20
MHz frequency selection
relative to the factory-stored
frequency value
Factory calibrated
V
DD
=3V
(1)
T
A
=[0, 70]°C,
V
DD
=[1.8, 5.5]V
-1.8 1.8 %
Δf
OSC20M
Calibration step size - 0.75 - %
D
OSC20M
Duty cycle - 50 - %
t
startup
Start-up time Within 2%
accuracy
- 12 - µs
Note:
1. See also the description of OSC20M on calibration.
2. Oscillator Frequencies above speed specification must be divided so the CPU clock is always
within specification.
Table 4-13. 32.768 kHz Internal Oscillator (OSCULP32K) Characteristics
Symbol Description Condition Min. Typ. Max. Unit
f
OSCULP32K
Factory calibration frequency 32.768 kHz
Factory calibration accuracy T
A
=25°C, 3.0V -3 3 %
E
TOTAL
Total error from target frequency T
A
=[0, 70]°C, V
DD
=[1.8, 3.6]V -10 +10 %
Full operation range -20 +20
D
OSCULP32K
Duty cycle 50 %
t
startup
Start-up time - 250 - µs
Table 4-14. 32.768 kHz External Crystal Oscillator (XOSC32K) Characteristics
Symbol Description Condition Min. Typ. Max. Unit
f
out
Frequency - 32.768 - kHz
t
startup
Start-up time C
L
=7.5 pF - 300 - ms
C
L
Crystal load capacitance
(1)
7.5 - 12.5 pF
C
TOSC1/TOSC2
Parasitic pin capacitance - 5.5 - pF
ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics
© 2019 Microchip Technology Inc.
Datasheet Preliminary
DS40002016B-page 16