Low Distortion IMX219 M12 Mount Camera Module for Raspberry Pi - Datasheet

ManualsBrandsArduCAM ManualsCameras & Vision SensorsLow Distortion IMX219 M12 Mount Camera Module for Jetson Nano

Table Of Contents

Description
Features
Device Structure
USE RESTRICTION NOTICE
1. Block Diagram and Pin Configuration
- 1-1 Block Diagram
- 1-2 Pin Description
- 1-3 Pin Equivalent Circuit
- 1-4 Chip Center, Optical Center and Pin Assignment
- 1-5 Pin Coordinates
2. Pixel Signal Output Specifications
- 2-1 CSI-2 Signalling Mode
  - 2-1-1 MIPI Transmitter
  - 2-1-2 Output Lane
    - 2-1-2-1 2Lane Output
3. Control Registers
- 3-1 2-wire Serial Communication Operation Specifications
- 3-2 2-wire Serial Communication Register Map (Configuration register, Parameter limit register)
- 3-3 Parameter Limit Registers – [0x1000-0x1FFF] (Read Only and Static)
  - 3-3-1 Integration Time and Gain Parameter Limit Registers – [0x1000-0x1301]
- 3-4 Manufacturer Specific Registers – [0x3000-0x5FFF ]
- 3-5 Frame Bank A and Bank B specific output samples
4. Output Data Format
- 4-1 CSI-2 Output Data Format
- 5-1 Pixel Array Physical Image
- 5-2 Pixel Binning Mode
- 5-3 image size
- 5-4 Readout Position
- 5-5 Frame Rate Calculation Formula
- 5-6 Black Level Control
- 5-7 Storage Time (Electronic Shutter) Settings
  - 5-7-1 Storage Time (Electronic Shutter) Setting Registers
  - 5-7-2 Storage Time Calculation Method
- 5-8 Gain Settings
  - 5-8-1 Analogue Gain Settings
  - 5-8-2 Digital gain settings
6. On Chip Image Processing
- 6-1 Test Pattern Generator
  - 6-1-1 Test Pattern
- 6-2 Digital Gain Setting
- 6-3 Black Level Adjust
- 6-4 Defect Correction
- 6-5 Pixel Re-alignment H Direction
- 6-6 Pixel Re-alignment V Direction
7. NVM Memory Map
- 7-1 Block Diagram
- 7-2 NVM Functions
- 7-3 Related Registers
- 7-4 NVM Memory Map
- 7-5 Defects Address registration
8. How to operate IMX219PQH5-C
- 8-1 Power on sequence
- 8-2 Power off sequence
9. Other Functions
- 9-1 Clock System
  - 9-1-1 Clock Structure
  - 9-1-2 EXCK_FREQ setting depend on INCK frequency
- 9-2 Clock Setting Example
- 9-3 Temperature Sensor
10. Electrical Characteristics
- 10-1 Absolute Maximum Ratings
- 10-2 Recommended Operating Conditions
- 10-3 Electrical Characteristics
- 10-4 AC Characteristics
  - 10-4-1 Master Clock Waveform Diagram
- 10-5 Electrical Characteristics
11. Spectral Sensitivity Characteristic
12. Image Sensor Characteristics
- 12-1 Image Sensor Characteristics
- 12-2 Zone Definition used for specifying image sensor characteristics
13. Measurement Method for Image Sensor Characteristics
- 13-1 Measurement conditions
- 13-2 Color Coding of This Image Sensor and Readout
- 13-3 Definition of Standard Imaging Conditions
- 13-4 Measurement method
14. Spot Pixel Specification
15. Notice on White Pixels Specifications
- 15-1 Measurement Method for Spot Pixels
- 15-2 Spot Pixel Pattern Specifications
16. Chief Ray Angle Characteristics
17. Connection Example
18. Notes On Handling

IMX219PQH5-C

17. Connection Example

VanaVdigVddl

AGNDDGND

2.2 µF

0.22 µ

1.0 µF

VDDLCN2

VSSLCN2

VSSLSC3

VDDLSC3

VDDLCN1

VSSLCN1

VSSLSC1

VDDLSC1

VDDHCM2

GPO

VSSHCM2

VDDHCM1

VSSHCM1

VSSLSC2

VDDHFIL1

VSSLDM1

VCP

VSSHSN1

TVMON

VDDLSC5

VSSLSC5

TENABLE

SCL

SDA

INCK

XCLR

VBO

VDDHSN1

VDDHAN

VSSHAN

SWTCK

TEST1

VDDHFIL2

VDDLIO1

VSSLIO1

VSSLIO2

VSSLIO3

VSSLIO4

VDDLIO2

DMO4P

DMO4N

DMO3P

DMO3N

DCKP

DCKN

DMO2P

DMO2N

DMO1P

DMO1N

VSSLDM2

VSSLSC6

POREN

VDDMCO

FSTROBE

VSSHSN2

VDDHSN2

Optical center

(-0.025,-91.065 µm)

VSSLSC4

VSSLSC7

VDDLSC7

VDDLSC6

VDDLSC8

Chip center

(0,0)

VDDHPL

VSSHPL

TVCDSIN

VSSLSC8

Fig. 50 Recommended Circuit

Pad open size

75 µm × 75 µm

Pad pitch

120 µm

85 µm × 85 µm (Only VDDHFIL1 pad)

Note) When fixing the voltage of chip back side, fix it to VDDHSN voltage

Note) GPO must be connected to GND, when GPO function is not enable.