Datasheet
Table Of Contents
- 1/2-Inch Megapixel CMOS Digital Image Sensor
- Applications
- General Description
- List of Tables
- List of Figures
- General Description
- Pixel Data Format
- Serial Bus Description
- Two-Wire Serial Interface Sample Write and Read Sequences
- Registers
- Feature Description
- Registers
- Electrical Specifications
- Data Output and Propagation Delays
- Two-wire Serial Bus Timing
- Figure 18: Serial Host Interface Start Condition Timing
- Figure 19: Serial Host Interface Stop Condition Timing
- Figure 20: Serial Host Interface Data Timing for Write
- Figure 21: Serial Host Interface Data Timing for Read
- Figure 22: Acknowledge Signal Timing After an 8-Bit Write to the Sensor
- Figure 23: Acknowledge Signal Timing After an 8-Bit Read from the Sensor
- Quantum Efficiency
- Image Center Offset and Orientation
- Revision History
®
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject to change,
as further product development and data characterization sometimes occur.
MT9M001 - 1/2-Inch Megapixel Digital Image Sensor
Electrical Specifications
80a3e031 Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT9M001_DS_2.fm - Rev.C 7/05 EN
31 ©2004 Micron Technology, Inc. All rights reserved.
Figure 27: 48-pin CLCC Package Outline Drawing
Note: All dimensions in millimeters.
SEATING
PLANE
1.016
TYP
148
11.176
LID MATERIAL: BOROSILICATE GLASS 0.55 THICKNESS
SUBSTRATE MATERIAL: ALUMINA CERAMIC
11.176
5.588
7.11
47X 1.02
1.016 TYP
48X 0.50
7.125 ±0.125
6.398 ±0.125
13.00
CTR
13.00
CTR
2.00
2.21 ±0.27
48X R 0.19
7.11
14.220
+0.300
-0.125
14.220
+0.300
-0.125
5.588
A
D
C
B
OPTICAL AREA
OPTICAL
CENTER
PACKAGE AND
DIE CENTER
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES B AND C : 1º
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A : 50 MICRONS
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER D : 50 MICRONS
0.015 FOR
REFERENCE
ONLY
FIRST CLEAR
PIXEL
0.712 FOR
REFERENCE ONLY
1.270 ±0.085
1
0.44 FOR
REFERENCE ONLY
0.94 ±0.26
1
LEAD FINISH:
GOLD PLATING,
20 MICRO INCHES
MINIMUM
THICKNESS
NOTE: 1. THESE DIMENSIONS ARE NON ACCUMULATIVE
元器件交易网www.cecb2b.com