Datasheet
Table Of Contents
- 1/2-Inch Megapixel CMOS Digital Image Sensor
- Applications
- General Description
- List of Tables
- List of Figures
- General Description
- Pixel Data Format
- Serial Bus Description
- Two-Wire Serial Interface Sample Write and Read Sequences
- Registers
- Feature Description
- Registers
- Electrical Specifications
- Data Output and Propagation Delays
- Two-wire Serial Bus Timing
- Figure 18: Serial Host Interface Start Condition Timing
- Figure 19: Serial Host Interface Stop Condition Timing
- Figure 20: Serial Host Interface Data Timing for Write
- Figure 21: Serial Host Interface Data Timing for Read
- Figure 22: Acknowledge Signal Timing After an 8-Bit Write to the Sensor
- Figure 23: Acknowledge Signal Timing After an 8-Bit Read from the Sensor
- Quantum Efficiency
- Image Center Offset and Orientation
- Revision History
80a3e031 Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT9M001_DS_2.fm - Rev.C 7/05 EN
30 ©2004 Micron Technology, Inc. All rights reserved.
MT9M001 - 1/2-Inch Megapixel Digital Image Sensor
Electrical Specifications
Image Center Offset and Orientation
Figure 25: Image Center Offset
Notes: 1. X and Y coordinates referenced to center of die.
2. Die center = package center.
3. Image center offset from package center (x = 0.015mm, y = 0.712mm).
Figure 26: Optical Orientation
Table 12: Optical Area Dimensions
Optical Area Pixel X-Dimension Y-dimension
SXGA Center of pixel (20, 12)
3,340.70µm 3,372.45µm
Center of Pixel (1299, 1035)
-3,315.2µm -1,952.35µm
Chip Size, mm (including Seal Ring)
7.75mm 7.75mm
Pad 1
Pixel (0,0)
Die Center
Image Center
7.75mm
Pixel
Array
0.015mm
0.712mm
Pixel (12, 20)
Black and
Boundary
Pixels
7.75mm
UP
Pin 1
Pixel Array
Top of board
Bottom of board
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