Datasheet-1
Table Of Contents
- 1/3-Inch Wide-VGA CMOS Digital Image Sensor
- Features
- Applications
- Ordering Information
- Table of Contents
- List of Figures
- List of Tables
- General Description
- Ball Descriptions
- Pixel Data Format
- Color Device Limitations
- Output Data Format
- Serial Bus Description
- Two-Wire Serial Interface Sample Read and Write Sequences
- Feature Description
- Operational Modes
- Signal Path
- On-Chip Biases
- Window Control
- Blanking Control
- Pixel Integration Control
- Variable ADC Resolution
- Gain Settings
- Black Level Calibration
- Row-wise Noise Correction
- Automatic Gain Control and Automatic Exposure Control
- Pixel Clock Speed
- Hard Reset of Logic
- Soft Reset of Logic
- STANDBY Control
- Monitor Mode Control
- Read Mode Options
- LINE_VALID
- LVDS Serial (Stand-Alone/Stereo) Output
- LVDS Output Format
- Electrical Specifications
- Package Dimensions
- Appendix A – Serial Configurations
- Appendix B – Power-On Reset and Standby Timing
- Revision History
PDF: 3295348826/Source:7478516499 Aptina reserves the right to change products or specifications without notice.
MT9V022_DS - Rev.H 6/10 EN
48 ©2005 Aptina Imaging Corporation. All rights reserved.
MT9V022: 1/3-Inch Wide-VGA Digital Image Sensor
Package Dimensions
Package Dimensions
Figure 45: 52-Ball IBGA
Notes: 1. All dimensions in millimeters.
Seating
plane
9.000 ±0.075
Optical
area
Optical
center
0.40
(for reference only)
0.90
(for reference only)
5.50
First
clear
pixel
Fuses
7.00
1.849
1.999
4.90
1.00 TYP
1.00 TYP
9.000 ±0.075
0.375 ±0.050
0.525 ±0.050
0.125 (for reference only)
C
L
C
L
C
L
C
L
7.00
3.50
0.10
A
A
D
C
B
Ball A1 ID
Ball A1
Ball A8
52X Ø0.55
Dimensions apply
to solder balls post
reflow. The pre-
reflow ball is Ø0.50
on a Ø0.4 NSMD
ball pad.
Encapsulant: epoxy
Image sensor die
Lid material: borosilicate glass 0.40 thickness
Substrate material: plastic laminate
Solder ball material: 96.5% Sn, 3% Ag, 0.5% Cu
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to package edge : 50 microns.
Maximum tilt of optical area relative to top of cover glass: 50 microns.
D
2.88 CTR
4.512 CTR
Ø0.15 A B C
Ø0.15 A C B