Datasheet
Table Of Contents
- applications
- features
- key specifications
- table of contents
- list of figures
- list of tables
- 1 signal descriptions
- 2 system level description
- 3 block level description
- 4 image sensor core digital functions
- 4.1 mirror and flip
- 4.2 image windowing
- 4.3 test pattern
- 4.4 50/60Hz detection
- 4.5 AEC and AGC algorithms
- 4.6 AEC/AGC steps
- 4.7 black level calibration (BLC)
- 4.8 strobe flash and frame exposure
- 4.9 xenon flash control
- 4.10 frame exposure (FREX) mode
- 4.11 FREX strobe flash control
- 4.12 one-time programmable (OTP) memory
- 5 image sensor processor digital functions
- 6 image sensor output interface digital functions
- 7 register tables
- table 7-1 system control registers (sheet 1 of 5)
- table 7-2 SCCB registers (sheet 1 of 2)
- table 7-3 group hold control registers
- table 7-4 AEC/AGC 1 registers
- table 7-5 system timing registers (sheet 1 of 3)
- table 7-6 AEC/AGC 2 registers (sheet 1 of 3)
- table 7-7 STROBE/frame exposure control registers (sheet 1 of 2)
- table 7-8 50/60 HZ DETECTION registers
- table 7-9 OTP control registers (sheet 1 of 2)
- table 7-10 BLC registers (sheet 1 of 3)
- table 7-11 frame control registers
- table 7-12 DVP registers (sheet 1 of 2)
- table 7-13 MIPI top registers (sheet 1 of 11)
- table 7-14 ISPFC registers
- table 7-15 ISP TOP control registers (sheet 1 of 6)
- table 7-16 AWB registers (sheet 1 of 3)
- table 7-17 average registers (sheet 1 of 2)
- table 7-18 DPC registers
- table 7-19 LENC registers (sheet 1 of 4)
- table 7-20 cluster DPC registers (sheet 1 of 2)
- table 7-21 windows registers
- table 7-22 AEC/AGC 3 registers
- 8 operating specifications
- 9 mechanical specifications
- 10 optical specifications
- revision history
Confidential for truly Only
PRELIMINARY SPECIFICATION proprietary to OmniVision Technologies
iii
ordering information
OV05647-G04A (color, chip probing, 200 µm
backgrinding, reconstructed wafer)
00applications
cellular phones
toys
PC multimedia
digital still cameras
00features
1.4 µm x 1.4 µm pixel with OmniBSI technology for
high performance (high sensitivity, low crosstalk, low
noise)
optical size of 1/4"
automatic image control functions: automatic
exposure control (AEC), automatic white balance
(AWB), automatic band filter (ABF), automatic
50/60
Hz luminance detection, and automatic black
level calibration (ABLC)
programmable controls for frame rate, AEC/AGC
16-zone size/position/weight control, mirror and flip,
cropping, windowing, and panning
image quality controls: lens correction, defective
pixel canceling
support for output formats: 8-/10-bit raw RGB data
support for video or snapshot operations
support for LED and flash strobe mode
support for internal and external frame
synchronization for frame exposure mode
support for horizontal and vertical sub-sampling
standard serial SCCB interface
digital video port (DVP) parallel output interface
MIPI interface (two lanes)
32 bytes of embedded one-time programmable
(OTP) memory
on-chip phase lock loop (PLL)
embedded 1.5V regulator for core power
programmable I/O drive capability, I/O tri-state
configurability
support for black sun cancellation
00key specifications
active array size: 2592 x 1944
power supply:
core: 1.5V + 5% (with embedded 1.5V regulator)
analog: 2.6 ~ 3.0V (2.8V typical)
I/O: 1.7V ~ 3.0V
power requirements:
active: TBD
standby: TBD
temperature range:
operating: -30°C to 70°C (see table 8-2)
stable image: 0°C to 50°C (see table 8-2)
output formats: 8-/10-bit RGB RAW output
lens size: 1/4"
lens chief ray angle: 24° (see figure 10-2)
input clock frequency: 6~27 MHz
S/N ratio: TBD
dynamic range: TBD
maximum image transfer rate:
QSXGA (2592 x 1944): 15 fps
1080p: 30 fps
960p: 45 fps
720p: 60 fps
VGA (640 x 480): 90 fps
QVGA (320 x 240): 120 fps
sensitivity: TBD
shutter: rolling shutter / global shutter
maximum exposure interval: 1968 x t
ROW
pixel size: 1.4 µm x 1.4 µm
well capacity: TBD
dark current: TBD
fixed pattern noise (FPN): TBD
image area: 3673.6 µm x 2738.4 µm
die dimensions: 5520 µm x 4700 µm