Datasheet
Table Of Contents
- applications
- features
- key specifications
- table of contents
- list of figures
- list of tables
- 1 signal descriptions
- 2 system level description
- 3 block level description
- 4 image sensor core digital functions
- 4.1 mirror and flip
- 4.2 image windowing
- 4.3 test pattern
- 4.4 50/60Hz detection
- 4.5 AEC and AGC algorithms
- 4.6 AEC/AGC steps
- 4.7 black level calibration (BLC)
- 4.8 strobe flash and frame exposure
- 4.9 xenon flash control
- 4.10 frame exposure (FREX) mode
- 4.11 FREX strobe flash control
- 4.12 one-time programmable (OTP) memory
- 5 image sensor processor digital functions
- 6 image sensor output interface digital functions
- 7 register tables
- table 7-1 system control registers (sheet 1 of 5)
- table 7-2 SCCB registers (sheet 1 of 2)
- table 7-3 group hold control registers
- table 7-4 AEC/AGC 1 registers
- table 7-5 system timing registers (sheet 1 of 3)
- table 7-6 AEC/AGC 2 registers (sheet 1 of 3)
- table 7-7 STROBE/frame exposure control registers (sheet 1 of 2)
- table 7-8 50/60 HZ DETECTION registers
- table 7-9 OTP control registers (sheet 1 of 2)
- table 7-10 BLC registers (sheet 1 of 3)
- table 7-11 frame control registers
- table 7-12 DVP registers (sheet 1 of 2)
- table 7-13 MIPI top registers (sheet 1 of 11)
- table 7-14 ISPFC registers
- table 7-15 ISP TOP control registers (sheet 1 of 6)
- table 7-16 AWB registers (sheet 1 of 3)
- table 7-17 average registers (sheet 1 of 2)
- table 7-18 DPC registers
- table 7-19 LENC registers (sheet 1 of 4)
- table 7-20 cluster DPC registers (sheet 1 of 2)
- table 7-21 windows registers
- table 7-22 AEC/AGC 3 registers
- 8 operating specifications
- 9 mechanical specifications
- 10 optical specifications
- revision history
Confidential for truly Only
11.03.2009 PRELIMINARY SPECIFICATION proprietary to OmniVision Technologies
9-1
9 mechanical specifications
9.1 physical specifications
figure 9-1 die specifications
table 9-1 pad location coordinates (sheet 1 of 3)
pad
number
pad
name
x
coordinate
y
coordinate
x
pitch
y
pitch
pad
size
1 AVDD -2408 2280 154x100
2 AGND -2131 2280 277 0 154x100
3 DOGND -1888 2280 243 0 77x100
4 SCL -1722 2280 166 0 77x100
5 SDA -1571 2280 151 0 77x100
6 DVDD -1304 2280 267 0 77x100
7 SGND -1057 2280 247 0 154x100
8 GPIO1 -671 2280 386 0 77x100
(-2760, 2350)
(2760, 2350)
(2760, -2350)
(-2760, -2350)
die center (0, 0)
OV5647
5520 μm
352
297
184
228
176
208
201
168
176
166
150
150
166
150
160
190
150
150
150
150
150
168
182
150
150
175
237
284
279
375
277
234
166
151
267
247
386
234
234
234
207
176
160
208
168
209
207
277
254
205
284
374
20 μm20 μm
4700 μm
100 μm
77 μm
154 μm
100 μm
all dimensions and coordinates are in μm.note 1
1 22
2350
5647_COB_DS_9_1