Data Sheet

10.13.2009 PRODUCT SPECIFICATION proprietary to OmniVision Technologies
9-1
9 mechanical specifications
9.1 physical specifications
figure 9-1 package specifications
table 9-1 package dimensions
parameter symbol min typ max unit
package body dimension x A 2790 2815 2840 µm
package body dimension y B 2800 2825 250 µm
package height C 690 750 810 µm
ball height C1 100 130 160 µm
package body thickness C2 575 620 665 µm
thickness of glass surface to wafer C3 425 445 465 µm
ball diameter D 220 250 280 µm
total pin count N 23 (2 NC)
pin count x-axis N1 5
pin count y-axis N2 5
pins pitch x-axis J1 500 µm
pins pitch y-axis J2 500 µm
edge-to-pin center distance analog x S1 408 438 µm
edge-to-pin center distance analog y S2 413 443 µm
1234554321
A
B
C
D
7675_CSP_DS_9_1
E
A
A
B
C
D
E
J1
S1
B
J2
S2
bottom view
(bumps up)
top view
(bumps down)
C2
C1
glass die
CC3
side view
D
center of BGA (die) =
center of the package
X Y ZW
B C DA
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