Specification Sheet

Table Of Contents

• Perfect gap filler

• Particularly suitable to cool several modules

• Protection for sensitive processor chips

• Very simple application

• Non-conducting

• Non-capacitive

High Performance Thermal Pad

Thermal Pad

PAGE 1
Thermal Pad High Performance Thermal Pad • Perfect gap filler • Particularly suitable to cool several modules • Protection for sensitive processor chips • Very simple application • Non-conducting • Non-capacitive Designed by ARCTIC
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Thermal Pad High Performance Thermal Pad The ARCTIC Thermal Pad provides an efficient thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. The silicon based material outperforms generic pads by far, is flexible and adaptive and thus works also at low pressure. Specifications Dimensions 50 x 50 mm, 120 x 20 mm, 145 x 145 mm, 290 x 290 mm Thickness Thermal Conductivity 0.5 mm or 1.0 mm or 1.5 mm Hardness 6.