User's Manual
Table Of Contents
- Applications
- Ordering Information
- Product Description
- Functional Block Diagram
- Pin Out Diagram
- Pin Out Description
- Absolute Maximum Ratings
- Recommended Operating Conditions
- DC Electrical Characteristics
- Logic Characteristics
- AC Electrical Characteristics
- Figure 3: SE2565T Detector Characteristics
- Package Diagram
- Recommended Land and Solder Patterns
- Package Handling Information
- Branding Information
- Tape and Reel Information
- Document Change History
DATA SHEET
SE2565T: 2.4 GHz High Power Wireless LAN Power Amplifier
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202424A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012 7
Figure 5: SE2565T Recommended Land and Solder Pattern
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2565T is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended, please refer to:
“Quad Flat No-Lead Module Solder Reflow & Rework Information”, Document Number QAD-00045
“Handling, Packing, Shipping and Use of Moisture Sensitive QFN”, Document Number QAD-00044
Branding Information
Figure 6: SE2565T Branding
Caution! Class 1C ESD sensitive device
SiGe
2565T
Lot Code