Owner manual

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3CXENPAK92-A
XENPAK-LR 10GB Module
1310nm, 10K, SMF, SC RoHS6
XAUI Driver Characteristics
Parameter
Symbol
Min. Typ. Max.
Unit
Baud Rate - 3.125 - Gbit/s
Baud Rate Tolerance -100 - +100 ppm
Differential Amplitude 800 - 1600 mVPP
1.2V CMOS Interface Characteristics
Parameter
Symbol
Min. Typ. Max.
Unit
Baud Rate - 3.125 - Gbit/s
Baud Rate Tolerance -100 - +100 ppm
Differential Amplitude 200 - 1600 mVpp
Input High Voltage VIH 0.84 - 1.5 V
Input Low Voltage VIL -0.3 - 0.36 V
Input Pull-down Current
IIn 20 40 120 μA
Output High Voltage VOH 1.0 - - V
Output Low Voltage VOL - - 0.2 V
Pull up Resistance RLASI 10 - 22 k ohm
Capacitance
CLASI
- - 10 pF
Load Capacitance
CLoad
- -
320 pF
MDIO Bidirectional Interface Characteristics
Parameter
Symbol
Min. Typ. Max.
Unit
Input High Voltage VIHM 0.84 - 1.5 V
Input Low Voltage VILM -0.3 - 0.36 V
Output High Voltage VOHM 1.0 - 1.5 V
Output Low Voltage VOLM -0.3 - 0.2 V
Pull up Resistance RMDIO 200 - Note 1 Ohm
MDC min high/low time THM,TLM 160 - - ns
MDC Frequency
1/TCK TBD - 2.5 MHz
Setup time
TDIS 10 - - ns
Hold time
TDIH 10 - - ns