Specifications
8
NC lathes
Major heat-
generating components are a
chuck head, which grips workpieces and
tools, main bearings for grinding wheel
spindle head and drive motors. It is common
to “indirectly cool” the heat-
generating
components by flowing coolant into
a coolant
jacket (heat exchanging part).
Also, when using hydraulic hydrostatic
bearings at a chuck head or a grinding wheel
spindle head or when using a hydraulic
hydrostatic guide for a table transport
mechanism, OIL MATIC is essential
for
controlling t
he temperature of hydrostatic oil
with high precision.
Other than the above, OIL MATIC is used
such as for “coolant cooling” which controls
and stabilizes cutting fluid temperature.
Press machines
For press machines (particularly, high-speed
precision press machines), it is important to
maintain accuracy of bottom dead center to
achieve high working accuracy. Because of
this, it is essential to cool “lubricant oil” used
for the lubrication of sliding parts and
bearings of cam-crank mechanism. In
additi
on, there are many cases that machines
are warmed up to promptly stabilize the
machine body
temperature at initial operation
(start-up). In those cases, OIL MATIC is
widely used.
Semiconductor manufacturing equipment
Components of semiconductor man
ufacturing equipment that require temperature control
vary
with manufacturing process. The following are major components that require
temperature control.
Slicer ............................... :
For cooling grinding wheel spindle head for slicing wafers and
for cooling
machining fluid (pure water)
Multi-wire saw ................ :
For cooling multi-wire saw drive head for slicing wafers and for cooling
machining fluid (slurry)
Grinder for wafers .......... :
For cooling grinding wheel spindle head for finishing of wafer surfaces
and for cooling machining fluid
Polishing lathe, lap ........ :
For cooling rotary table
Thin film manufacturing equipment
:
For controlling temperature of plasma electrode chambers for PVD
equipment, CVD equipment, dry etching equipment, etc.
Exposure equipment ..... :
For controlling temperature of wafer drive stages and drive motors at
ultra-precision
Prober ............................. :
For controlling temperature of fixed
chuck for wafers
Dicer ................................ :
For cooling grinding wheel spindle
head for dicing wafers and for
cooling machining fluid (pure water)
Laser dicer...................... :
For cooling laser oscillator
Tester .............................. :
For controlling temperature of fixed
chuck for wafers
Physical, chemical and medical equipment
Case examples of temperature control in physical, chemical and medical equipment are as
follows: For cooling tubes (X-ray oscillating sources) in X-ray analysis equipment and
medical equipment, and for cooling laser oscillator in analysis equipment and medical
equipment that use laser.