Developer Note PowerBook G3 Series 1999 Computer 4/27/99 Technical Publications © Apple Computer, Inc.
Apple Computer, Inc. © 1999 Apple Computer, Inc. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, mechanical, electronic, photocopying, recording, or otherwise, without prior written permission of Apple Computer, Inc., except to make a backup copy of any documentation provided on CD-ROM. The Apple logo is a trademark of Apple Computer, Inc.
Contents Figures and Tables Preface 9 About This Developer Note Contents of This Note 11 Supplemental Reference Documents PowerPC G3 Microprocessor 12 Mac OS 12 ATA Devices 12 USB Devices 13 Open Firmware 13 Chapter 1 Introduction 11 12 15 Features 16 Peripheral Devices 18 Compatibility Issues 18 Earlier PowerBook G3 Series Computers Expansion Bay Modules 19 RAM Expansion Modules 19 USB Ports and Devices 19 System Software 19 Machine Identification 20 Chapter 2 Architecture 18 21 Processor Modu
ZiVA PC DVD Decoder 26 Ethernet PHYTER IC 26 USB Controller IC 26 Video Display Subsystem 26 Power Management Unit 27 Sound Interface IC 27 CardBus Controller IC 28 Modem Module 28 Chapter 3 Devices and Ports 29 USB Ports 30 USB Connectors 30 Transfer Types Supported 31 USB Compatibility Issues 32 Serial Port Compatibility 32 Macintosh-To-Macintosh Connections USB Storage Devices 32 USB Controller 32 External SCSI Port 33 Hard Disk Drive 34 Hard Disk Dimensions 34 Hard Disk Connector 36 Signal Assignmen
Infrared Communication Link 48 Flat Panel Display 48 External Monitors 49 Monitors and Picture Sizes 49 Monitor Connector 51 Monitor Adapter 51 External Video Connector 53 Sound System 55 Sound Inputs 55 Built-in Microphone 56 External Sound Input 56 Expansion Bay Sound Input 56 CardBus Sound Input 57 Sound Outputs 57 External Sound Output 57 Internal Speakers 57 Chapter 4 Expansion Features 59 Expansion Bay 60 Mechanical Design of Expansion Bay Modules 60 Expansion Bay Connectors 62 Signals on the Expa
Chapter 5 System Software 75 The New Approach 76 What Has Changed 77 Features of the New Approach 78 Performance 78 RAM Footprint 79 User Experience 79 Data Structures and Files 79 Compatibility 79 Boot ROM Contents 80 POST Code 81 Open Firmware 81 81 Mac OS 'ndrv' Drivers RTAS 82 Mac OS ROM Image File Contents 82 Open Firmware Script 83 Trampoline Code 83 Mac OS ROM Image 83 NewWorld Boot Process 83 What Is Different 84 Interrupt Handling 85 Outmoded Resources 85 RAM Footprint 85 RTAS 85 NV-RAM 86 NanoK
Appendix A Abbreviations Index 91 95 7
Figures and Tables Chapter 2 Chapter 3 Chapter 4 Architecture 21 Figure 2-1 Block diagram Table 2-1 Clock speeds Devices and Ports 23 24 29 Figure 3-1 Figure 3-2 Figure 3-3 Figure 3-4 Figure 3-5 Figure 3-6 Figure 3-7 Figure 3-8 USB Type A port 31 Maximum dimensions of the internal hard disk 35 Hard disk connector and location 36 Keyboard layout 40 Alternate operations of function and control keys 41 Embedded numeric keypad operation 42 Signal pins on the video connector 51 S-video connector 53
Table 4-1 Table 4-2 Table 4-3 Table 4-4 Table 4-5 Table 4-6 Table 4-7 10 Signals on the expansion bay connector 62 Audio and control signals on the expansion bay connector ATA signals on the expansion bay connector 64 Unused IDE signals on the expansion bay connector 66 Power lines on the expansion bay connector 66 Sizes of RAM expansion devices and modules 71 Types of DRAM devices 72 64
P R E F A C E About This Developer Note This developer note is a technical description of the PowerBook G3 Series 1999 computer, with the emphasis on the features that are new or different from those of earlier PowerBook computers. This developer note is intended to help hardware and software developers design products that are compatible with the Macintosh products described here.
P R E F A C E Supplemental Reference Documents 0 For more information about the technologies mentioned in this developer note, you may wish to consult some of the following references. PowerPC G3 Microprocessor 0 For more information about the PowerPC 750™ microprocessor used in the PowerBook computer, developers may wish to refer to the standard reference, PowerPC 740/750 Microprocessor Implementation Definition Book IV.
P R E F A C E USB Devices 0 For more information about USB on Macintosh computers, developers should refer to Apple Computer’s Mac OS USB DDK ATI Reference. Information is also available on the World Wide Web, at: http://developer.apple.com/dev/usb/ For full specifications of the Universal Serial Bus, developers should refer to the USB Implementation Forum on the World Wide Web, at: http://www.usb.org/developers/index.
P R E F A C E IEEE Std 1275-1994 Standard for Boot (Initialization, Configuration) Firmware (Version 1.7) Open Firmware Recommended Practice: Device Support Extensions (Version 1.0) Open Firmware Recommended Practice: Interrupt Mapping (Version 0.
C H A P T E R Figure 1-0 Listing 1-0 Table 1-0 1 Introduction 1 15
C H A P T E R 1 Introduction The PowerBook G3 Series 1999 computer carries forward the architecture of the previous PowerBook G3 Series with a slimmer case and more powerful features. This chapter summarizes the features of the new PowerBook G3 Series computer and addresses issues affecting compatibility with older machines and software. Features 1 Here is a list of the features of the PowerBook G3 Series 1999 computer. Each feature is described in a later chapter, as indicated in the list.
C H A P T E R 1 Introduction ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Graphics acceleration: The ATI Rage Pro graphics controller along with the 8 MB of video RAM provide 2D and 3D acceleration. For more information, see “Video Display Subsystem” (page 26). Battery bays: The computer has two battery bays, one on either side. The computer can operate with the AC power adapter or with one or two batteries installed. Each battery uses lithium ion cells and provides 4800 mAh at a nominal 10.8 V.
C H A P T E R 1 Introduction ■ ■ Weight: The computer weighs 2.7–2.9 kg (5.9–6.4 pounds) depending on the configuration. Size: The computer is 310 mm (12.2 inches) wide, 249 mm (9.8 inches) deep, and 43 mm (1.7 inches) thick. Peripheral Devices 1 In addition to the devices that are included with the computer, certain peripheral devices are available separately: ■ ■ The Macintosh PowerBook Intelligent Lithium Ion Battery is available separately as an additional or replacement battery.
C H A P T E R 1 Introduction Expansion Bay Modules 1 The expansion bay in the PowerBook computer is not the same as those in the PowerBook G3 Series and PowerBook 3400 computers. Expansion bay modules designed for earlier PowerBook computers will not fit in the PowerBook computer. For more information, see “Mechanical Design of Expansion Bay Modules” (page 60). RAM Expansion Modules 1 For RAM expansion, the PowerBook G3 computer uses standard SO-DIMMs that contain SDRAM devices.
C H A P T E R 1 Introduction product-specific features. For a description of the general Mac OS 8.6 release, developers should refer to the Technote for Mac OS 8.6. The technote is available on the Technote web site at http://devworld.apple.com/dev/technotes.shtml Machine Identification With the New World software, it is no longer possible to use the Box Flag to identify the computer model. For guidelines about machine identification, see “Machine Identification” (page 88).
C H A P T E R Figure 2-0 Listing 2-0 Table 2-0 2 Architecture 2 21
C H A P T E R 2 Architecture This chapter describes the architecture of the PowerBook G3 Series 1999 computer with emphasis on the aspects that are new or different from those of earlier PowerBook computers. The architecture of the PowerBook G3 Series 1999 computer is designed around two main circuit boards: the processor module and the main logic board. Figure 2-1 is a block diagram showing the major components and the relationship of the processor module and the main logic board.
C H A P T E R 2 Architecture Figure 2-1 Block diagram Processor module Modem module Modem controller RAM SO-DIMM Datapump Telephone connector RAM SO-DIMM 512 KB or 1 MB backside L2 cache Addr Internal microphone 1MB ROM PowerPC G3 microprocessor DAA Data Addr Screamer sound IC Grackle memory controller and PCI bus bridge Main logic board PCI bus Sound in Sound out Speakers Paddington I/O and disk controller Expansion bay connector DP83843 PHYTER Ethernet IrDA link SCSI 8MB SDRAM I
C H A P T E R 2 Architecture The G3 microprocessor in the PowerBook G3 Series 1999 computer runs at a clock speed of 333 or 400 MHz. Table 2-1 shows how the speeds of the CPU clock, the backside cache, and the main memory bus are related. The PowerPC G3 family of microprocessors includes the PowerPC 740™ and the PowerPC 750™; the PowerBook G3 Series computers use the PowerPC 750. Backside Cache 2 The controller and the tag storage for the backside cache are built into the microprocessor chip.
C H A P T E R 2 Architecture on the main logic board. The Grackle IC also contains the controller for the main memory. The main memory bus runs at a clock speed of 66.67 MHz. The internal PCI bus runs at 33.33 MHz. To enhance performance, the Grackle IC supports concurrent transactions on the main memory bus and the PCI bus. Information about the Grackle IC is available on the World Wide Web at http://www.mot.com/SPS/PowerPC/products/semiconductor/ support_chips/106.
C H A P T E R 2 Architecture The Paddington IC is also used in the iMac computer and is similar to the Heathrow IC used in the Power Macintosh G3 computers and Macintosh PowerBook G3 computers. The main difference is that the Paddington IC supports 100Base-TX Ethernet as well as 10Base-T. ZiVA PC DVD Decoder 2 Some configurations have a built-in DVD decoder IC: a ZiVA-PC made by C-Cube Microsystems. The IC provides video support for a DVD drive in the expansion bay.
C H A P T E R 2 Architecture The graphics controller IC is an ATI Rage LT Pro. It contains 2D and 3D acceleration engines, a digital video port, front-end and back-end scalers, a CRT controller, and a PCI bus interface with bus master capability. For information about the display, see “Flat Panel Display” in Chapter 3, “Devices and Ports.” For information about external monitors and projection devices, see “External Monitors” also in Chapter 3.
C H A P T E R 2 Architecture CardBus Controller IC 2 The CardBus controller IC is a PCI1210 device made by Texas Instruments. It supports both 16-bit PC Cards and 32-bit CardBus Cards. Modem Module 2 The built-in modem is on a separate hardware module that is connected to SCC port A of the Paddington IC. The module contains a modem controller IC, a datapump, and the interface to the telephone line (DAA). See “Internal Modem” (page 47).
C H A P T E R Figure 3-0 Listing 3-0 Table 3-0 3 Devices and Ports 3 29
C H A P T E R 3 Devices and Ports This chapter describes both the built-in I/O devices and the ports for connecting external I/O devices. Each of the following sections describes an I/O port or device. USB Ports 3 The PowerBook G3 Series 1999 computer has two Universal Serial Bus (USB) ports that can be used to connect additional I/O devices such as a USB mouse, printers, scanners, and low-speed storage devices.
C H A P T E R 3 Devices and Ports Figure 3-1 1 2 USB Type A port 3 Table 3-1 4 Pin assignments on the USB port Pin Signal name Description 1 VCC +5 VDC 2 D– Data – 3 D+ Data + 4 GND Ground The computer provides 5-volt power at 500 mA for each of the two ports. The USB ports support both low-speed and high-speed data transfers, at up to 1.5 Mbits per second and 12 Mbits per second, respectively. High-speed operations requires the use of shielded cables.
C H A P T E R 3 Devices and Ports Version 1.2 of the Macintosh USB system software provides functions that support all four transfer types. USB Compatibility Issues 3 The USB ports take the place of the ADB and serial I/O ports found on earlier Macintosh computers, but they do not function the same way. The following sections describe the differences.
C H A P T E R 3 Devices and Ports interoperate with an OHCI controller. Those devices will not be supported by the Macintosh USB system software. External SCSI Port 3 The computer has a connector for adding external SCSI devices such as a hard disk drive or a removable media drive. The connector is an HDI-30 high-density 30-pin connector. The signal assignments are listed in Table 3-2. Table 3-2 Signals on the HD-30 SCSI connector.
C H A P T E R 3 Devices and Ports Hard Disk Drive 3 The PowerBook G3 Series 1999 computer has an internal hard disk drive with a storage capacity of 4, 6, or 10 GB. The drive uses the extended IDE (integrated drive electronics) interface, which is also referred to as the ATA interface. The implementation of the ATA interface on this computer is a subset of the ATA/ IDE specification, ANSI proposal X3T10/0948D, Revision 2K (ATA-2).
C H A P T E R 3 Devices and Ports Figure 3-2 Maximum dimensions of the internal hard disk 12.70 maximum [0.500 maximum] 3.00 [0.118] 14.00 [0.551] 34.93 ± 0.38 [1.375 ± 0.015] 90.60 [3.567] 38.10 [1.500] 101.85 maximum [4.01 maximum] 4.06 [0.160] M3, 3.0 mm thread depth minimum, 8X 61.72 [2.430] M3, 2.5 mm thread depth minimum, 8X 69.85 [2.75] Note: Dimensions are in millimeters [inches].
C H A P T E R 3 Devices and Ports Hard Disk Connector 3 The internal hard disk has a 48-pin connector that carries both the ATA signals and the power for the drive. The connector has the dimensions of a 50-pin connector, but with one row of pins removed, as shown in Figure 3-3. The remaining pins are in two groups: pins 1–44, which carry the signals and power, and pins 46–48, which are reserved. Pin 20 has been removed, and pin 1 is located nearest the gap, rather than at the end of the connector.
C H A P T E R 3 Devices and Ports Table 3-3 Pin number Pin assignments on the ATA hard disk connector Signal name Pin number Signal name 1 /RESET 2 GROUND 3 DD7 4 DD8 5 DD6 6 DD9 7 DD5 8 DD10 9 DD4 10 DD11 11 DD3 12 DD12 13 DD2 14 DD13 15 DD1 16 DD14 17 DD0 18 DD15 19 GROUND 20 KEY 21 DMARQ 22 GROUND 23 /DIOW 24 GROUND 25 /DIOR 26 GROUND 27 IORDY 28 CSEL 29 /DMACK 30 GROUND 31 INTRQ 32 /IOCS16 33 DA1 34 /PDIAG 35 DA0 36 DA2 37
C H A P T E R 3 Devices and Ports ATA Signal Descriptions 3 Table 3-4 describes the signals on the ATA hard disk connector. Table 3-4 Signals on the ATA hard disk connector Signal name 38 Signal description DA(0–2) Device address; used by the computer to select one of the registers in the ATA drive. For more information, see the descriptions of the CS0 and CS1 signals. DD(0–15) Data bus; buffered from IOD(16–31) of the computer’s I/O bus.
C H A P T E R 3 Devices and Ports Table 3-4 Signal name Signals on the ATA hard disk connector (continued) Signal description INTRQ Interrupt request. This active high signal is used to inform the computer that a data transfer is requested or that a command has terminated. /PDIAG Asserted by device 1 to indicate to device 0 that it has completed the power-on diagnostics; not available on this computer (n.c.). /RESET Hardware reset to the drive; an active low signal.
C H A P T E R 3 Devices and Ports the F1 key; the other is between the F8 and F9 keys. The user can release the latches by pulling them toward the front of the computer. There is also a keyboard locking screw, which is accessible from the back of the computer, above the reset button next to the RJ-11 connector. Turning the screw five or six turns counter-clockwise unlocks the keyboard.
C H A P T E R 3 Devices and Ports Figure 3-5 Alternate operations of function and control keys fn key is down and checkbox is unchecked, or fn key is up and checkbox is checked. fn key is up and checkbox is unchecked, or fn key is down and checkbox is checked. fn key is up. fn key is up. fn key is down. fn key is down. Note: Characters on highlighted keys are enlarged for clarity.
C H A P T E R 3 Devices and Ports Figure 3-6 Embedded numeric keypad operation num lock is off and fn key is down. num lock is off and fn key is up. num lock is on.
C H A P T E R 3 Devices and Ports Fn Key 3 Pressing the Fn key affects three sets of keys: the function keys F1–F12, the embedded numeric keypad, and certain modifier keys. ■ ■ ■ It toggles the function keys between their normal control functions and their alternate F1–F12 functions, as shown in Table 3-5 and Figure 3-5. It selects the embedded numeric keypad on the right portion of the alphanumeric keys, as shown in Table 3-6 and Figure 3-6.
C H A P T E R 3 Devices and Ports keys checkbox and the Fn key. Table 3-5 is a list of the function keys and their operation as control buttons.
C H A P T E R 3 Devices and Ports affected by the Fn key and the Num Lock key. Table 3-6 is a list of the keys making up the embedded keypad. Table 3-6 Embedded keypad keys Key name Keypad function 6 Clear 7 7 8 8 9 9 0 / - = U 4 I 5 O 6 P * J 1 K 2 L 3 ; – M 0 , NOP . . / + Other Alphanumeric Keys 3 When the embedded numeric keypad is active, the other alphanumeric keys can be made to have no operation (NOP).
C H A P T E R 3 Devices and Ports Control Keys 3 The cursor control keys are also used as page control keys. Another set of keys take on the functions of keys on a PC keyboard, for use with PC emulation software. These keys are affected by the Fn key. Table 3-7 is a list of the affected keys and their alternate functions.
C H A P T E R 3 Devices and Ports The connector for the Ethernet port is a a short, shielded RJ-45 connector on the back of the computer. Table 3-8 shows the signals and pins on the connector.
C H A P T E R 3 Devices and Ports Infrared Communication Link 3 The computer has a directed infrared (IR) communication link connected internally to serial port B. When the computer is placed within range of another device with an IR interface, it can send and receive serial data using one of several communications protocols.
C H A P T E R 3 Devices and Ports external monitor set to 640 by 480 or 800 by 600, the image on the internal display is smaller than the screen. For resolution settings larger than 1024 by 768, the image on the external monitor is smaller than the screen. When the flat panel display and an external video monitor are operating at the same time, half the video memory is available for each, so the maximum pixel depth at the largest image sizes is less.
C H A P T E R 3 Devices and Ports multiple scan monitors, and the latest Apple Studio Displays. The computer also supports VGA, SVGA, and XGA monitors. Table 3-10 lists the picture sizes and frame rates supported.
C H A P T E R 3 Devices and Ports Table 3-10 Picture sizes supported (continued) Picture size (pixels) Frame rate Pixel depth, flat panel inactive Pixel depth, flat panel active 1280 by 960 75 Hz 24 bpp 16 bpp 1280 by 1024 60 Hz 24 bpp 16 bpp 1280 by 1024 75 Hz 24 bpp 16 bpp The computer includes 8 MB of video memory, which is enough to provide pixel depths up to 24 bits per pixel on all supported monitors.
C H A P T E R 3 Devices and Ports Table 3-11 Signals on the video connector Pin Signal name Description 1 RED Red video signal 2 GREEN Green video signal 3 BLUE Blue video signal 4 MONID(0) Monitor ID signal 0 5 GND DDC return 6, 7, 8 AGND_VID Analog video ground 9 +5V_IO 5 V power for I/O device 10 GND HSYNC and VSYNC ground 11 VGA_ID VGA ID signal 12 MONID(2) Monitor ID signal 2 13 HSYNC Horizontal synchronization signal 14 VSYNC Vertical synchronization signal
C H A P T E R 3 Devices and Ports Note The first time the user starts up with an SVGA or XGA monitor, the video card treats it as a VGA monitor and shows a 640-by-480 pixel display. The user can switch to a larger display mode from the Monitors & Sound control panel; when that happens, the computer changes the display to the larger mode immediately and uses that mode the next time it is started up.
C H A P T E R 3 Devices and Ports Table 3-12 Pin assignments for the S-video output connector Pin number S-video output connector 1 Analog GND 2 Analog GND 3 Video Y (luminance) 4 Video C (chroma) 5 Composite video 6 Unused 7 Unused An adapter is available that can be plugged into the S-video connector and accepts an RCA plug from a composite video monitor.
C H A P T E R 3 Devices and Ports Table 3-13 Picture sizes for composite video output Picture size Pixel depth 800 by 600 24 bpp 832 by 624 24 bpp 1024 by 768 24 bpp Sound System 3 The 16-bit stereo audio circuitry provides high-quality sound input and output through the built-in microphone and speakers. The user can also connect external input and output devices by way of the sound input and output jacks.
C H A P T E R 3 Devices and Ports The microphone and the sound input jack have dedicated input channels on the Screamer IC; the sound input from the PC Card slot has its own input, and the other three inputs share an input on the IC. Those three inputs are switched on and off by the hardware; they can be selected one at a time for play-through or recording.
C H A P T E R 3 Devices and Ports CardBus Sound Input 3 The CardBus socket has a pin (SPKR_OUT) that carries a one-bit digital sound signal output from the PC Card and input to the computer’s sound system. The one-bit digital signal from the sound output pin is routed to the Screamer IC, which in turn sends it to the built-in speaker and the external sound output jack.
C H A P T E R 3 Devices and Ports 58 Sound System
C H A P T E R Figure 4-0 Listing 4-0 Table 4-0 4 Expansion Features 4 59
C H A P T E R 4 Expansion Features This chapter consists of three sections, each of which describes one of the expansion features of the new PowerBook G3 Series computer: ■ “Expansion Bay” ■ “RAM Expansion Slots” ■ “CardBus Slot” Expansion Bay 4 The battery bay on the right side of the computer also operates as an expansion bay. The expansion bay accepts an expansion module containing either a power device or a storage device.
C H A P T E R 4 Expansion Features Figure 4-1 Front view of the expansion bay module Guide rail Latching notch Figure 4-2 Back view of the expansion bay module Guide rail Locating pin Guide rail Connector IMPORTANT Expansion modules for earlier PowerBook models will not work in a new PowerBook G3 series computer. ▲ To allow room for a 5.25-inch disk, the expansion module has a wing extending toward the back of the computer.
C H A P T E R 4 Expansion Features Expansion Bay Connectors 4 The expansion bay has two connectors: a five-contact connector for batteries and a 60-pin connector for data devices. This section describes only the 60-pin connector. The connector used on the expansion modules is Foxconn part number QL00303-A601. For information about obtaining this connector, contact Apple Developer Support.
C H A P T E R 4 Expansion Features Table 4-1 Pin Direction 8 9 I/O 10 11 O 12 Signals on the expansion bay connector (continued) Signal name Pin Direction Signal name GND 38 I/O IDE_D(8) IDE_D(0) 39 I/O IDE_D(11) IDE_INTRQ 40 IDE_ADDR(1) 41 GND 42 +5V I/O IDE_D(13) GND 13 O IDE_ADDR(0) 43 I/O IDE_D(2) 14 O /CS1FX 44 I/O IDE_D(1) +5V 45 /CS3FX 15 16 I/O IDE_D(3) 46 GND 17 I/O IDE_D(4) 47 IDE_ADDR(2) GND 48 18 O /DMACK 19 I/O IDE_D(5) 49 GND 20
C H A P T E R 4 Expansion Features tables describe the three types of signals: Table 4-2 describes the audio and control signals and Table 4-3 (page 64) describes the ATA signals. Table 4-2 Signal name Signal description /DEVIN This signal should be low whenever a device is installed in the expansion bay; it is used by the Paddington IC to determine when a device has been inserted or removed. The expansion bay module should connect this pin to ground. /IDE_RST Reset signal.
C H A P T E R 4 Expansion Features Table 4-3 ATA signals on the expansion bay connector (continued) Signal name Signal description IDE_ADDR(0–2) IDE device address; used by the computer to select one of the registers in the drive. For more information, see the descriptions of the /CS1FX and /CS3FX signals. IDE_D(0–15) IDE data bus, buffered from IOD(16–31) of the controller IC. IDE_D(0–15) are used to transfer 16-bit data to and from the drive buffer.
C H A P T E R 4 Expansion Features Unused IDE Signals on the Expansion Bay Connector 4 Several signals defined in the standard interface for the IDE drive are not used by the expansion bay. Those signals are listed in Table 4-4 along with any action required for the device to operate in the expansion bay. Table 4-4 Unused IDE signals on the expansion bay connector Signal name Comment CSEL This signal must be tied to ground to configure the device as the master in the default mode.
C H A P T E R 4 Expansion Features User Installation of an Expansion Bay Module 4 The user can insert a module into the expansion bay while the computer is operating. This section describes the sequence of control events in the computer and gives guidelines for designing an expansion bay module so that such insertion does not cause damage to the module or the computer.
C H A P T E R 4 Expansion Features When a module is resinserted into the expansion bay, the triggering event is the same: 7. When a module is reinserted, the /DEV_IN signal goes low. The Paddington IC responds by generating an interrupt, but keeps external signals deactivated, because the new device may be different from the one inserted previously.
C H A P T E R 4 Expansion Features running—your instructions to the user should include warnings about the possibility of data corruption. RAM Expansion Slots 4 The computer has two RAM expansion slots that accommodate standard SO (small outline) DIMMs using SDRAM devices. One slot is on the bottom of the system module and is normally occupied by the factory-installed SO-DIMM. The other slot is on the top of the system module and is available for a user-installed SO-DIMM.
C H A P T E R 4 Expansion Features SO-DIMMS, one with a height up to 1.5 inches and the other with a height up to 2.0 inches. IMPORTANT The JEDEC specifications for the heights of the SO-DIMMs gives a plus-or-minus 0.15 mm tolerance. In the PowerBook G3 Series computer, the specified heights for the SO-DIMMs are maximum heights. ▲ The JEDEC specification defines the maximum depth or thickness of an SO-DIMM as 3.8 mm.
C H A P T E R 4 Expansion Features The devices are programmed to operate with a CAS latency of 3. At that CAS latency, the access time from the clock transition must be 7 ns or less. The burst length must be at least 4 and the minimum clock delay for back-to-back random column access cycles must be a latency of 1 clock cycle. When the computer is in sleep mode, the maximum power-supply current available for each bank of SDRAM is 6 mA (see the section “RAM SO-DIMM Electrical Limits”).
C H A P T E R 4 Expansion Features Table 4-6 Sizes of RAM expansion devices and modules (continued) Device size Device configuration Devices per bank Size of each bank Size of SO-DIMM 64 Mbits 512K x 32 x 4 2 16 MB 128 MB 128 Mbits 4M x 8 x 4 8 128 MB 256 MB 128 Mbits 2M x 16 x 4 4 64 MB 256 MB The computer accepts either one or two SO-DIMMs. The bottom slot can accommodate a 1.5-inch SO-DIMM with up to 128 MB of SDRAM. The top slot can accommodate a 2.
C H A P T E R 4 Expansion Features Table 4-7 Types of DRAM devices (continued) Device size Device configuration Size of row address Size of column address 64 Mbits 4M x 4 x 4 12 10 64 Mbits 4M x 8 x 2 13 9 64 Mbits 2M x 8 x 4 12 9 64 Mbits 2M x 16 x 2 13 8 64 Mbits 1M x 16 x 4 12 8 64 Mbits 1M x 32 x 2 13 7 64 Mbits 512K x 32 x 4 12 7 128 Mbits 4M x 8 x 4 13 9 128 Mbits 2M x 16 x 4 13 8 IMPORTANT The PowerBook G3 Series computer supports only the types of SDRAM
C H A P T E R 4 Expansion Features The restriction on sleep current is required not only to maximize the battery life but to meet the limitations of the backup battery during hot swapping of the main battery. CardBus Slot The CardBus slot accepts one Type II card. The slot supports both 16-bit PC Cards and 32-bit CardBus Cards. The card can be removed and replaced while the computer is operating. The slot supports Zoomed Video on the card connector.
C H A P T E R Figure 5-0 Listing 5-0 Table 5-0 5 System Software 5 75
C H A P T E R 5 System Software The PowerBook G3 Series 1999 computer is different from previous PowerBook computers in that it has no single, large ROM that contains many components of the Mac OS software, along with the 68K emulator, hardware initialization, and the nanokernel. Instead, a small ROM provides hardware initialization functions and provides a mechanism to load the Mac OS ROM image into RAM.
C H A P T E R 5 System Software ■ ■ The high-level Mac OS and system software does not need to change often. When making a new build as a result of changing hardware-dependent code, there is high confidence that the high-level software has not been changed. Not changing the higher level software as often simplifies things for many groups inside Apple, including testing, system software, software configuration management, developer support, and publications.
C H A P T E R 5 System Software Most of the changes are completely transparent to the Mac OS. Only the Startup Disk control panel is affected: it includes added code to modify the Open Firmware’s configuration variables in the NV-RAM. Features of the New Approach 5 Because the 1999 PowerBook G3 Series computer has new hardware features that are different from other PowerBook computers, new software features are needed in addition to the NewWorld requirements for other computers.
C H A P T E R 5 System Software comparable CPUs and speeds due to the improved interrupt handling with the NewWorld approach. In addition, performance is improved due to executing code that normally exists in ROM in RAM, because the RAM devices operate faster than the ROM devices normally used. RAM Footprint 5 The 1999 PowerBook G3 Series computer has its Mac OS ROM image stored in RAM. This removes approximately 3 megabytes of RAM from availability for other uses.
C H A P T E R 5 System Software The Mac OS ROM image is kept in a file in the System Folder on the specified boot device. In order to avoid problems with localizing the name, the file is located by file type instead of by name. In order for Open Firmware to retrieve the Mac OS ROM image file, it must be able to read the selected boot device.
C H A P T E R 5 System Software POST Code 5 The Power-on Self Test (POST) software is executed when the computer first boots. This encompasses many of the traditional Macintosh ROM operations and is based on the hardware initialization code used in the past: setup and initialization of the processor and ASICs, a boot beep, an error beep, diagnostics, and transfer to Open Firmware. A small debugging mini-nub is part of this section. It allows prodding and poking with some MacsBug-like commands.
C H A P T E R 5 System Software RTAS 5 RTAS (Run-Time Abstraction Services) can be thought of as a BIOS (basic input/output system). RTAS code handles hardware accesses needed by an operating system, making it possible for multiple operating systems to get hardware services without having to know the specifics.
C H A P T E R 5 System Software Open Firmware Script 5 The bootinfo components normally do not need to be changed for each new product. The Open Firmware script is automatically modified at build time to have the correct offsets within the bootinfo file to the other two main components. Trampoline Code 5 The Trampoline code is the component of the NewWorld architecture that handles the transition between Open Firmware and the Mac OS ROM Image.
C H A P T E R 5 System Software 3. Open Firmware loads the Mac OS ROM image file, based on defaults and NV-RAM settings. 4. Open Firmware executes the Forth script in the bootinfo file, which contains instructions to read both the Trampoline code and the compressed Mac OS ROM Image and place them into a temporary place in memory. 5. The Forth script transfers control to the Trampoline code, which functions as the transition between Open Firmware and the beginning of the Mac OS execution. 6.
C H A P T E R 5 System Software Interrupt Handling 5 Interrupt handling is very different with the NewWorld approach. The interrupt code has been rewritten to allow for dynamic creation of the interrupt layout. The new code has two features that did not exist in the old code. One is that interrupt latency has been reduced to such an extent as to make it negligible.
C H A P T E R 5 System Software NV-RAM 5 Instead of using hard-coded offsets to locations in NV-RAM for Mac OS NV-RAM and other information, the Trampoline code breaks NV-RAM into variable-sized partitions that are used by Mac OS, Open Firmware, and any other client. PRAM resides in the Mac OS partition. The partitioning scheme is part of the CHRP specification. NanoKernel 5 The previous version of the NanoKernel has code that is processor-specific to create data structures.
C H A P T E R 5 System Software ■ C: force the internal CD-ROM drive to be the startup device ■ D: force the internal hard disk to be the startup device Once Open Firmware locates a startup device and successfully loads a Mac OS ROM image, it passes information about the chosen device in the bootpath variable. This information, rather than that previously set in PRAM, is subsequently used by the Mac OS ROM to locate the device containing the startup System Folder.
C H A P T E R 5 System Software startup include display, keyboard, and mouse devices, and storage devices such as hard drives and CD-ROM drives. IMPORTANT If Open Firmware code is not included in the expansion card for a startup device, the card will not be usable until the operating system loads its supporting software from disk after the startup process has concluded.
C H A P T E R 5 System Software IMPORTANT Programs such as control panels and installers that use Box Flag to verify that this is a valid CPU on which to execute need to be changed to verify the existence of the hardware they require. Developers should look for the features they need, rather than reading the box flag and then making assumptions about the computer’s features.
C H A P T E R 5 System Software 90 What Is Different
A P P E N D I X Figure A-0 Listing A-0 Table A-0 A Abbreviations A Standard units of measure used in this note include: A amperes MB megabytes dB decibels Mbps megabits per second GB gigabytes Mbit megabits Hz hertz MHz megahertz KB kilobytes mm millimeters kg kilograms ns nanoseconds kHz kilohertz V volts mA milliamperes VDC volts direct current mAh milliampere-hours Other abbreviations used in this note include: $n hexadecimal value n 10Base-T an Ethernet standard
A P P E N D I X A Abbreviations 92 CD-ROM compact disc read-only memory CHRP Common Hardware Reference Platform CPU central processing unit CRM Communications Resource Manager CRT cathode ray tube, a video display device DAA data access adapter (a telephone line interface) DAC digital-to-analog converter DIMM Dual Inline Memory Module DMA direct memory access EDO extended data out EEPROM electrically eraseable programmable ROM G3 Generation 3, the third generation of PowerPC micro
A P P E N D I X A Abbreviations modem modulator-demodulator, a data communications interface for use with analog telephone lines NMI nonmaskable interrupt NOP no operation NV-RAM nonvolatile random-access memory OHCI Open Host Controller Interface OS operating system PCI Peripheral Component Interconnect, an industry-standard expansion bus PLL phase-locked loop POST power-on self test RAM random-access memory RAID random array of inexpensive disks RCA Radio Corporation of America
A P P E N D I X Abbreviations 94 A
Index A abbreviations 91 access to internal components 40 ATA devices, TechNote for 12 ATA Device Software Guide 12, 34 ATA disk interface 34 ATA hard disk 34 See also hard disk drive ATI Rage LT Pro IC 27 B backside cache 24 boot ROM 77 contents of 80–82 box flag 88 USB 30 custom ICs Paddington I/O controller 25 Screamer sound IC 27, 55 D DDC monitors 52 device tree 83, 87 displays external monitors 50 adapter for 51 DDC monitors 52 VGA, SVGA, and XGA monitors 50, 53 flat panel 48 mirror mode resolution
I N D E X external monitors 49–53 connector 51 DDC monitors 52 mirrow mode with 49 pixel depths available 51 VGA, SVGA, and XGA monitors 50, 53 F FCode 87 features 16 flat panel display 48 function keys, alternate functions of 43 Function-keys checkbox, in Keyboard control panel 43 G G3 microprocessor 22, 24 gestaltMachineType value 88 Grackle IC 24 IDE hard disk 34 See also hard disk drive identifying the machine 88 interrupts 85, 88 I/O controller ICs 25 IR (infrared) communication link 48 JEDEC speci
I N D E X modem 47 modem module 28 monitor adapter 51 monitor connector 51 monitors.
I N D E X SDRAM devices 69 specifications of 70 serial presence detect, on SO-DIMM 70 SO-DIMMs 69 address multiplexing on 72 configurations 71 electrical design of 70 electrical limits for 73 mechanical design of 69 SDRAM device specifications 70 serial presence detect on 70 sound IC 27, 55 sound sample rates 55 sound specifications 55 sound system 55–57 electrical characteristics 56, 57 input sources 55 built-in microphone 56 expansion bay 56 PC card 57 internal speakers 57 output devices 57 speakers 57 s
I N D E X 99
T H E A P P L E P U B L I S H I N G This Apple manual was written, edited, and composed on a desktop publishing system using Apple Macintosh computers and FrameMaker software. Line art was created using Adobe™ Illustrator and Adobe Photoshop. Text type is Palatino® and display type is Helvetica®. Bullets are ITC Zapf Dingbats®. Some elements, such as program listings, are set in Adobe Letter Gothic.
