AirPrime Intelligent Embedded Modules Hardware Integration Guide 2130114 Rev 2.
Preface Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
AirPrime Embedded Module Hardware Integration Guide Patents Portions of this product may be covered by some or all of the following US patents: 5,515,013 5,929,815 6,400,336 6,785,830 6,968,171 7,200,512 D560,911 5,629,960 6,169,884 6,516,204 6,845,249 6,985,757 7,295,171 5,845,216 6,191,741 6,561,851 6,847,830 7,023,878 7, 287,162 5,847,553 6,199,168 6,643,501 6,876,697 7,053,843 D442,170 5,878,234 6,339,405 6,653,979 6,879,585 7,106,569 D459,303 5,890,057 6,359,591 6,697,030 6,886,049 7,145,267 D59
Preface Revision History Revision number Release date Changes 1.5 July 2007 • Added 8780/81 content • Added SED description • Fixed details about capacitance • Added connector pin details • Removed references to RUIM (MC57xx products) • Removed “Diversity antenna must fold down” (Diversity antenna design requirements on page 93). • Removed references to MC5720, MC8755, MC8755V, and MC8765.
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Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Related documents . . . . . . . . . . . . . . . . . . . . . . . .
AirPrime Embedded Module Hardware Integration Guide Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Power supply noise . . . . . . .
Contents USB interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 USB handshaking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 USIM interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 USIM operation . . . . . . . . . . . . . . . . . . . . . . . . . . .
AirPrime Embedded Module Hardware Integration Guide Antenna design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 General antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Main antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Diversity antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . 93 GPS antenna design requirements . . . . . . . . . . . . . . . . . . . .
1 1: Introduction Sierra Wireless’ AirPrime Intelligent Embedded Modules form the radio component for the products in which they are embedded. Table 1-1 identifies embedded modules that are available for use on CDMA and GSM networks.
AirPrime Embedded Module Hardware Integration Guide The Universal Development Kit Sierra Wireless manufactures a Universal Development Kit (UDK) that facilitates all phases of the integration process. This kit is a hardware development platform that is designed to support the AirPrime embedded modules listed in Table 1-1 on page 11.
Introduction 6. Thermal Considerations on page 65 Describes thermal characteristics of the module and provides suggestions for testing and addressing thermal issues. 7. Design Checklist on page 67 Summarizes design considerations for integration of AirPrime embedded modules in your host devices. 8. Testing on page 69 Describes suggested acceptance, certification, production, and quality assurance tests. 9. Antenna Specification on page 91 Describes antenna requirements and testing details. 10.
AirPrime Embedded Module Hardware Integration Guide Table 1-2: Related documentation (Continued) Document title Description CDMA Extended AT Command Reference (Document 2130621) Proprietary AT commands for AirPrime CDMA embedded modules. For UMTS-specific commands, see AirPrime MC8xxx Embedded Modules Extended AT Command Reference (Document 2130616).
Introduction Table 1-2: Related documentation (Continued) Document title Description AirPrime MC8xxx Embedded Modules Extended AT Command Reference (Document 2130616) Proprietary AT commands for UMTS AirPrime embedded modules. For CDMA-specific commands, see the CDMA Extended AT Command Reference (Document 2130621). Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module (3GPP TS 11.10-4) SIM testing methods.
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2 2: Power Interface Overview of operation Note: This chapter contains information for both CDMA (MC57xx) and GSM (MC8xxx) AirPrime embedded modules. Information that is unique to specific module types is clearly identified. AirPrime embedded modules are designed to use a 3.3V (nominal) power supply (3.8V for the MC8201) provided by the host.
AirPrime Embedded Module Hardware Integration Guide Electrostatic discharge (ESD) You are responsible for ensuring that the host has adequate ESD protection on digital circuits and antenna ports as described by the following specifications: • (Operational) RF port (antenna launch and RF connector): IEC-61000-4-2— Level (Electrostatic Discharge Immunity Test) • (Non-operational) Host connector interface: JESD22-A114-B +/- 1kV Human Body Model and JESD22-C101 +/- 125 V Charged Device Model • MC5728V onl
Power Interface Disconnected state Note: The difference between the Disconnected and Off states is that, in the Off state, the module is still connected to the power source and draws minimal current. This state occurs when there is no power to the module—the host power source is disconnected from the module and all voltages associated with the module are at 0 V.
AirPrime Embedded Module Hardware Integration Guide Voltage monitoring state machine Figure 2-2 illustrates the state machine used to monitor the VCC supply, and Table 2-1 details the voltage conditions that trigger state changes. current_vcc > VOLT_LO_NORM Host asserts W_Disable# Low Supply Voltage Critical (Low power mode) current_vcc < VOLT_LO_CRIT current_vcc < VOLT_LO_WARN Power off. Handled by Power State state machine.
Power Interface State change: Normal mode to Low Power mode This state change causes the module to suspend RF activity. It occurs when the module’s supply voltage exceeds either the high (VOLT_HI_CRIT) or low (VOLT_LO_CRIT) limits detailed in Table 2-1 on page 20. When this state change occurs, the CnS notification CNS_RADIO_POWER is issued, if enabled. For a detailed description of this notification, see CDMA CnS Reference (Document 2130754) or MC87XX Modem CnS Reference (Document 2130602) as appropriate.
AirPrime Embedded Module Hardware Integration Guide Temperature monitoring state machine Figure 2-3 illustrates the state machine used to monitor the embedded module’s temperature, and Table 2-2 details the temperature conditions that trigger state changes. current_temp <= TEMP_HI_NORM Host asserts W_Disable# High Temperature Critical (Low power mode) current_temp > TEMP_HI_CRIT current_temp > TEMP_HI_WARN Normal mode Power off. Handled by Power State state machine.
Power Interface When this state change occurs, the CnS notification CNS_RADIO_POWER is issued, if enabled. For a detailed description of this notification, see CDMA CnS Reference (Document 2130754) or MC87XX Modem CnS Reference (Document 2130602) as appropriate. As well, the MC57xx issues the CnS notification Modem Too Hot [0x4500] if it has to drop a call when shifting to low power mode. State change: Low Power mode to Normal mode This state change causes the module to resume RF activity.
AirPrime Embedded Module Hardware Integration Guide Inrush currents The following power events can cause large inrush currents from the host supply to the module on the power pins: • Application of the host’s power supply • Host leaves W_Disable# floating (high impedance) to power up the module (as shown in Figure 2-1 on page 17). Figure 2-4 and Figure 2-5 show the inrush models for the MC57xx and MC8xxx.
Power Interface Inrush current via application of host power supply This event occurs when the host’s supply is enabled, charging the input capacitors on the embedded module’s power rail. The switches shown in Figure 2-4 on page 24 and Figure 2-5 on page 24 are open (typically) when this event occurs. Note: In some circumstances, depending on temperature and the components in use, two or more regulators may switch on at the same time. The host power system must be designed to handle this possibility.
AirPrime Embedded Module Hardware Integration Guide 3.3V 3.8V (MC8201) W_Disable# Enumeration USB D+ Startup time Figure 2-6: Power-up timing diagram Note: Startup time is the time after power-up when the modem is ready to begin the enumeration sequence. Transmit power wave form (GSM) As shown in Figure 2-7, at maximum GSM transmit power, the input current can remain at 2.4 A for up to 25% of each 4.6 ms GSM cycle (1.15 ms). For Class 12 operation, the peak could remain for 2.3 ms (four timeslots).
Power Interface Current consumption overview Electrical requirements and current specifications are listed in the following tables: Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Table 1-2 on page 13)—in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD.
AirPrime Embedded Module Hardware Integration Guide Table 2-3: Current specifications (MC57xx) (Continued) Current consumption (mA) Condition Min Typical Max CDMA Sleep, default slot cycle = 2 (MC5727/MC5727V) 1.4 1.7 1.75 CDMA Sleep, default slot cycle = 2 (MC5728V) 1.9 2.1 5.6 Deep Sleep Average (MC5727/MC5727V/MC5728V) 0.5 0.7 1.5 Shutdown (MC5727/MC5727V) 0.25 0.30 0.35 Shutdown (MC5728V) 0.24 0.27 0.
Power Interface Table 2-4: Current specifications (MC8201) a (Continued) Description Band Typ Max Units Notes / Configuration Averaged Call Mode GSM/EDGE data DC power consumption (with 4 time slots) 650 mA Max PCL for each bandd 300 mA 10 dBm Tx EDGE 620 mA Class 12d Peak current (averaged over 100 s) 2.60 A Worst case on 850. GSM/GPRS a. b. c. d.
AirPrime Embedded Module Hardware Integration Guide Table 2-5: Current specifications (MC8700) a , b (Continued) Description Band Typ Max Units Notes / Configuration Averaged Call Mode GSM/EDGE data DC power consumption (with 4 time slots) 700 mA Max PCL for each bande 400 mA 10 dBm Tx EDGE 720 mA Class 12e Peak current (averaged over 100 s) 2.70 A Worst case on 850/900 band. GSM/GPRS a. b. c. d. e. Quad GSM All measurements are preliminary values Measurements are for MDM8200 MDM2.
Power Interface Table 2-6: Current specifications (MC8775 / MC8775V) (Continued) Description Band Typ Max Units Notes / Configuration 300 - mA +5 dBm Tx power 210 - mA +13 dBm Tx power 300 - mA +29 dBm Tx power GSM850 & GSM900 360 - mA +33 dBm Tx power Quad GSM 180 - mA 1 Rx/1 Tx slot 180 - mA 2 Rx/1 Tx slot 240 - mA 4 Rx/2 Tx slot 163 mA 489 mA peak 180 - mA 1 Rx/1 Tx slot 180 - mA 2 Rx/1 Tx slot 240 - mA 4 Rx/2 Tx slot 2.3 2.
AirPrime Embedded Module Hardware Integration Guide Table 2-7: Current specifications (MC8780 / MC8781) (Continued) Description Band Typ Max Units Notes / Configuration (Maximum power) Averaged WCDMA/HSDPA data current consumption (includes USB bus current) WCDMA Bands I, II, V HSUPA HSDPA (1.8 Mbps/3.6 Mbps/ 7.
Power Interface Table 2-8: Current specifications (MC8790 / MC8790V / MC8791V / MC8792V ) (Continued) Description Band Typ Max Units Notes / Configuration 4 5 mA State is entered when Watcher (or other application) shuts down/turns off the radio.
AirPrime Embedded Module Hardware Integration Guide Table 2-9: Current specifications (MC8795V) (Continued) Description Band Typ Max Units Notes / Configuration Bands I, II, V, VI, VIII 700 mA 384 kbps at 20 dBm Tx powera 350 mA 0 dBm Tx power 750 mA 2 Mbps at 20 dBm Tx power 420 mA 0 dBm Tx power HSDPA (1.8 Mbps/3.6 Mbps/ 7.
Power Interface Modes Transmit and Receive modes Current consumption in transmit or receive mode (in a call or data connection) is affected by several factors, such as: • Radio band being used • Transmit power • Receive gain settings • Data rate • Number of active Transmit time slots (for transmit mode) Sleep mode Sleep mode is the normal state of the module between calls or data connections.
AirPrime Embedded Module Hardware Integration Guide This process continues until the unexpected power-cycle issue is resolved— either a firmware download occurs, or the module doesn’t reset spontaneously within 30 seconds of power-on. Usage models Usage models can be used to calculate expected current consumption. A sample usage model is provided in Table 2-11, based on the values in Table 2-3 on page 27 for a CDMA module.
3 3: RF Integration This chapter provides information related to RF (Radio Frequency) integration of AirPrime embedded modules with host devices. The frequencies of operation and performance specifications vary depending on the module model used. RF performance parameters for typical modules are listed in Table 3-1 and Table 3-2.
AirPrime Embedded Module Hardware Integration Guide Table 3-2: RF Parameters (MC8xxx) (Continued) Module / Frequencies (MHz) PCS 1900 a Tx: 1850–1910 Rx: 1930–1990 UMTS AirPrime embedded module (MC8xxx) 8201 8700 8775 8775V 8780 8781 8790 9890v 8791V 8792V 8795V Conducted Rx sensitivity (dBm)b Worst case: -105 Typical: -107 Cond
RF Integration RF connection When attaching an antenna to the module: Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01)) to prevent damage to the module or coaxial cable assembly. • Use a Hirose U.FL connector (model U.FL #CL331-0471-0-10) to attach an antenna to a connection point on the module, as shown in Figure 3-1 (main RF connector or diversity RF/GPS connector).
AirPrime Embedded Module Hardware Integration Guide Ground connection When connecting the module to system ground: • Prevent noise leakage by establishing a very good ground connection to the module through the host connector. • Connect to system ground using the two mounting holes at the top of the module (shown in Figure 3-1 on page 39). • Minimize ground noise leakage into the RF. Depending on the host board design, noise could potentially be coupled to the module from the host board.
RF Integration Determining the antenna’s location Consider the following points when deciding where to put the antenna: • Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applications, the placement of the antenna is still very important—if the host device is insufficiently shielded, high levels of broadband or spurious noise can degrade the module’s performance. • Connecting cables between the module and the antenna must have 50 impedance.
AirPrime Embedded Module Hardware Integration Guide Interference from other wireless devices Wireless devices operating inside the host device can cause interference that affects the module.
RF Integration Methods to mitigate decreased Rx performance It is important to investigate sources of localized interference early in the design cycle. To reduce the effect of device-generated RF on Rx performance: • Put the antenna as far as possible from sources of interference. The drawback is that the module may be less convenient to use. • Shield the host device. The module itself is well shielded to avoid external interference. However, the antenna cannot be shielded for obvious reasons.
AirPrime Embedded Module Hardware Integration Guide same accuracy as a full-size anechoic chamber, but is sufficient for this application. A base station simulator, such as an Agilent 8960 (shown) or Rohde & Schwarz CMU200, is used to provide FER (Frame Error Rate) measurements. Agilent 8960 call box Approx . 1 m Figure 3-2: Anechoic chamber Path loss calculation The chamber is calibrated for path loss using a reference antenna with known gain that is feeding a spectrum analyzer or power meter.
RF Integration Positioning the DUT (Device Under Test) To achieve meaningful results, the device must be positioned such that the peak of the receive antenna pattern is pointed toward the source antenna. Theoretically, the best way to accomplish this is to modify the DUT so that antenna output is through coaxial cable. The device is then rotated until the receive power is maximized.
AirPrime Embedded Module Hardware Integration Guide Sensitivity test results—MC57xx Figure 3-3 shows typical test results for the US PCS band for both conducted and over-the-air connections. The conducted (or "connectorized") measurements were made using an RF coaxial cable connection. The over-the-air measurements were made using both an external antenna and a typical device antenna.
4 4: Audio Interface AirPrime embedded modules that support voice (MC5727V / MC5728V / MC8775V/MC8790V/MC8791V/MC8792V/MC8795V) support the following audio modes that may be required by a host audio system: Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents on page 13)— in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD.
AirPrime Embedded Module Hardware Integration Guide These modules are intended to serve as an integral component of a more complex audio system—for example, a PDA with a separate codec interfaced to the Host Application processor. Usually, the interface between the module and the host audio system is set to line-level amplitudes with no transducer considerations. The responsibility of the module codec or host codec for special functions is detailed in Table 4-2 on page 48.
Audio Interface MIC_P TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N MIC_N 57.
AirPrime Embedded Module Hardware Integration Guide TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N TX ADC CodecTxGain Audio In 13 bit A/D HPF & Slope MIC_AMP1 0 dB or +24 dB RF Filter 33n nsSw itch TxPCMFilt NS & AAGC Tx FIR 13K CELP/ EVRCEncoder +12dB to -84dB PCM I/F CodecSTGain 0dB to -96dB 22p CodecRxGain EchoCancellation MIC1P MIC1N +12dB to -84dB TxVolume Encoder DTMF Tx Gain DTMF Decoder DTMF Encoder Decoder RF Interface DTMF Rx Gain RX_HPF_DIS_N 25mW @+3dBm0 SPK1N SPK1P 13 bit D/A HPF
Audio Interface PCM Audio interface MIC_P TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N MIC_N 57.3mVrms @ 0dBm0 HPF & Slope PCM I/F CodecSTGain +12dB -48dB -96dB 22p CodecRxGain AMP_SEL 001 010 100 SPK_P NS & AAGC +12dB -3dB -84dB TxPCMFilt TxVolume Tx FIR 13K CELP/ EVRC Encoder +12dB 0dB -84dB MIC_AMP1_GAIN -6dB to +49.5dB in 1.
AirPrime Embedded Module Hardware Integration Guide Gain distribution Table 4-3: System gain values a Mode Modem TX gain (dB) Modem RX gain (dB) Typical system TX gain (dB) Typical system RX gain (dB) Handset +8 +8 +28 +32 Headset +8 +8 +28 +24 Car Kit +16 +8 +36 +32 Speakerphone +16 +8 +36 +32 a. Typical system gains are estimates only and vary from system to system depending upon transducer sensitivity.
Audio Interface Table 4-4: Echo cancellation details (Continued) Mode Details Car kit Speakerphone • Long echo path (<64 ms travel time from speaker to microphone) • Loud echo • For use with hands-free car kit or speakerphone applications with mild distortion • Long echo path (<64 ms travel time from speaker to microphone) • Loud echo • For use with speakerphone applications with high distortion • Half-duplex algorithm, very aggressive in near-end Tx muting to eliminate transmitted echo O
AirPrime Embedded Module Hardware Integration Guide Table 4-6: PCM digital audio signal interface Signal Pin # Type Direction Description PCM_CLK 45 Digital Output PCM clock PCM_DIN 47 Digital Input (internal pull-down) PCM data in PCM_DOUT 49 Digital Output PCM data out PCM_SYNC 51 Digital Input (internal pull-down) PCM sync Audio function partitioning The following phone-oriented functions are usually under module control: • FIR filters—Transmit and receive paths • Noise suppr
5 5: Host/Module Interfaces This chapter provides information about specific host interface pin assignments, the host-module communication interface (USB interface), LED outputs, USIM interface, and lists extended AT commands that may be useful for hardware integration testing. Host interface pin details Detailed connector pin information is available in the product specification documents for each module—refer to these documents when integrating modules into your host devices.
AirPrime Embedded Module Hardware Integration Guide Table 5-2: MC8790V / MC8791V / MC8792V / MC8795V 2.6 V connector pins a Pin Signal name Description 1 MIC_P Microphone Positive 3 MIC_N Microphone Negative 6 GPIO_1 General Purpose I/Ob 16 GPIO_2 General Purpose I/Ob 22 AUXV1 Auxiliary Voltage 1 (ADC input, 0–2.
Host / Module Interfaces • Enumeration of the module as a set of /dev/ttyUSBn devices for Linux systems with the Sierra Wireless driver installed • USB-compliant transceivers USB handshaking Note: If you are using Sierra Wireless drivers, you can skip this section—it is intended for developers who are creating their own USB drivers. The host must act as a USB host device to interface with the module.
AirPrime Embedded Module Hardware Integration Guide Host USB driver requirements The USB driver on the host device must meet these critical requirements: • The host USB driver must support remote wakeup, resume, and suspend operations as described in Universal Serial Bus Specification, Rev 2.0. • The host USB driver must support serial port emulation. The module implements both 27.010 multiplexing and USB-CDC.
Host / Module Interfaces USIM interface Note: This section applies only to UMTS (MC8xxx) modules. The module is designed to support one USIM (Universal Subscriber Identity Module). The USIM holds account information, allowing users to use their account on multiple devices. The USIM interface has four signals (plus Ground). These are defined in Table 5-4 with an example circuit shown in Figure 5-2 on page 60. (For USIM card contacts, see Figure 5-3 on page 60.) Table 5-4: USIM pins Pin name Rev 2.0 Apr.
AirPrime Embedded Module Hardware Integration Guide 4.7uF X5R typ XIM_VCC (Optional. Locate near the USIM socket) 15 k - 30 k Located near USIM socket (Optional. Locate near the USIM socket) 47 pF, 51 XIM_VCC (C1) XIM_CLK (C3) XIM_CLK XIM_IO XIM_DATA (C7) XIM_RESET XIM_RESET (C2) GND GND (C5) USIM card connector Located near USIM socket.
Host / Module Interfaces USIM operation Note: For interface design requirements, refer to: (2G) 3GPP TS 51.010-1, section 27.17, or (3G) ETSI TS 102 230 V5.5.0, section 5.2. When designing the remote USIM interface, you must make sure that the USIM signal integrity is not compromised.
AirPrime Embedded Module Hardware Integration Guide • Protect the USIM socket to make sure that the USIM cannot be removed while the module/host device is powered up. For example, you could place the socket under the battery (for portable devices); consider similar options for other device types. • Test your first prototype host hardware with a Comprion IT3 USIM test device at a suitable testing facility.
Host / Module Interfaces Table 5-5: MC57xx Extended AT commands (Continued) Command Description Provisioning commands !CARRIERID Display the carrier ID CDMA commands !STATUS Display the status of the modem !SCI Get slot cycle index Power control commands !PCSTATE Power control state !PCINFO Read the power control information !PCTEMP Read the power control temperature !PCVOLT Read the power control voltage Table 5-6: MC8xxx Extended AT commands Command Passwordprotected Description Passwo
AirPrime Embedded Module Hardware Integration Guide Table 5-6: MC8xxx Extended AT commands (Continued) Command 64 Passwordprotected Description !DAGGRSSIRAW Return the raw RSSI (GSM mode) !DAGINFO Return GSM mode RF information !DAGSLOCK Return the RF synthesizer lock state !DAGSRXBURST Set the GSM receiver to burst mode !DAGSRXCONT Set the GSM receiver continually on !DAGSTXBURST Set the GSM transmitter to burst mode !DAGSTXFRAME Set the GSM Tx frame structure !DAOFF
6 6: Thermal Considerations Embedded modules can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons. The amount of thermal dissipation required depends on the following factors: • Supply voltage—Maximum power dissipation for these modules can be up to 3.1 W (or 3.5 W for the MC8700 in HSPA+ mode) at voltage supply limits. • Usage—Typical power dissipation values depend on the location within the host, amount of data transferred, etc.
AirPrime Embedded Module Hardware Integration Guide Figure 6-1: Shield locations Note: Make sure that your system design provides sufficient cooling for the module. The RF shield temperature should be kept below 90°C when integrated to prevent damage to the module’s components.
7 7: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.
AirPrime Embedded Module Hardware Integration Guide Table 7-1: Hardware integration design considerations (Continued) Suggestion Section where discussed EMI / ESD Investigate sources of localized interference early in the design cycle. Methods to mitigate decreased Rx performance on page 43 USIM operation on page 61 Provide ESD protection for the USIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET lines).
8 8: Testing Note: All AirPrime embedded modules are factory-tested to ensure they conform to published product specifications. Developers of OEM devices integrating Sierra Wireless AirPrime embedded modules should include a series of test phases in their manufacturing process to make sure that their devices work properly with the embedded modules.
AirPrime Embedded Module Hardware Integration Guide Acceptance test requirements To perform the suggested tests, you require a test system in which to temporarily install the module, and you must be able to observe the test device’s LED indicator. Acceptance test procedure The following is a suggested acceptance testing procedure using Sierra Wireless’ Watcher software: Note: You can perform these tests using appropriate AT commands. Test 1: Check power-up and initialization 1.
Testing • Underwriters Laboratories Inc. (www.ul.com) • (MC57xx only) CDG (CDMA Development Group—www.cdg.org) • (MC8xxx only) GCF (Global Certification Forum— www.globalcertificationforum.org) outside of North America • (MC8xxx only) PTCRB (PCS Type Certification Review Board— www.ptcrb.com) in North America Production testing Note: Production testing typically continues for the life of the product.
AirPrime Embedded Module Hardware Integration Guide Suggested production tests Consider the following tests when you design your production test procedures for devices with the MC57xx and/or MC8xxx installed.
Testing 5. Test USB functionality—Check for USB enumeration. · (Windows systems) The Device Manager shows Sierra Wireless items under the Ports - (COM & LPT) entry. The devices shown depend on the module type. For example: · MC8xxx · MC57xx · (Linux systems) Enter the command ls /dev/tty/USB* and then record and compare the results with those from Step 3. If there are any new ttyUSBn devices, then the modem has enumerated successfully.
AirPrime Embedded Module Hardware Integration Guide 6. Some modules cause a Sierra Wireless Network Adapter to appear in Device Manager, as shown below for MC57xx. Disable the adapter to allow entry of AT commands when performing diagnostic tests: a. Right-click the Sierra Wireless Network Adapter to display the context menu. b. Click Disable. MC57xx 7.
Testing 8. Display the firmware version: · MC57xx: AT+GMR · MC8xxx: AT!GVER Example response: · p2005000,0 [Aug 09, 2006 14:28:24],, VID: PID: Characters 5–6 are the firmware version (50 in this example). 9. Test the LED—Set the LED in blinking mode using this command, then visually verify that the LED turns off and on: · MC57xx: AT!LED=0,1 · MC8xxx: AT!DLED or AT!LEDCTRL 10. Unlock the extended AT command set: · MC57xx: AT!OEM=176 · MC8xxx: AT!ENTERCND 11.
AirPrime Embedded Module Hardware Integration Guide Downloading and configuring minicom for Linux systems Note: This procedure is for Ubuntu systems. If you are using a different Linux distribution, use the appropriate commands for your system to download minicom. To download and configure minicom in a Ubuntu system: Note: To install minicom, you must have root access, or be included in the sudoers list. 1. Download and install minicom—enter the following command: sudo apt-get install minicom 2.
Testing b. Zero-calibrate the meter. c. Enable MAP mode. Note: These AT commands generate a modulated test signal. 2. Prepare the DUT using the following AT commands: a. AT!OEM=176 (Unlock the extended AT command set) b. AT!DIAG (Set modem in diagnostic mode) c. AT!CHAN=600,1 (PCS band, channel 600) or AT!CHAN=384,0 (Cellular band, channel 384) The power meter should read -100 dBm, indicating no signal. d. AT!TX=1 (Turn on transmitter) e.
AirPrime Embedded Module Hardware Integration Guide Table 8-1: Test settings — MC8xxx transmission path (Continued) Mode GSM Bands Test category 850 900 1800 1900 Band 18 10 11 12 Channel 190 65 697 661 2100 To test the DUT’s transmitter path: Note: This procedure describes steps using the "Power Meter: Gigatronics 8651A” (with Option 12 and Power Sensor 80701A). 1. Set up the power meter: a.
Testing 3. Test limits—Run ten or more good DUTs through this test procedure to obtain a nominal output power value. · Apply a tolerance of 5 to 6 dB to each measurement (assuming a good setup design). · Monitor these limits during mass-production ramp-up to determine if further adjustments are needed. · For GSM mode, the transmit signal is bursted, so the transmit power will appear averaged on the power meter reading. Note: The MC8xxx has a nominal output power of +23 dBm 1 dB in WCDMA mode.
AirPrime Embedded Module Hardware Integration Guide Note: This example setup uses a 200 kHz offset from band center for testing using a continuous wave— you can use any appropriate baseband frequency offset (for example, 100 kHz, 300 kHz, etc.). If using a modulated signal, set the frequency to band center with no offset. a. Press the Frequency button to set the frequency to 1960.200 MHz for PCS band, Channel 600, or 881.720 MHz for Cellular band, Channel 384 b.
Testing Testing RF Receive path—MC8xxx Note: This procedure segment is performed in Step 14 of the Suggested production test plan procedure on page 72. Table 8-2 contains parameters used in the suggested test procedure that follows. Table 8-2: Test settings — MC8xxx Receive path Bands Mode Test category WCDMA GSM 850 900 Frequencya (MHz) 882.60 Band Channel Frequencyb (MHz) 1800 1900 2100 948.60 1961.2 2141.2 22 29 15 9 4182 2812 9400 9750 881.667 948.067 1842.267 1960.
AirPrime Embedded Module Hardware Integration Guide 2. Set up the DUT: a. AT!UNLOCK=”” (Unlock extended AT command set.) or AT!ENTERCND (Unlock extended AT command set.) b. AT!DAFTMACT (Put modem into factory test mode.) c. AT!DASBAND= (Set frequency band.) · See Table 8-2 on page 81 for values d. AT!DASCHAN= (Set modem channel) · See Table 8-2 on page 81 for values e. AT!DASLNAGAIN=0 (Set the LNA to maximum gain.) f. (WCDMA mode) i.
Testing iii. AT!DASBAND= (Set frequency band.) · See Table 8-2 on page 81 for values iv. AT!DAWSSCHAIN=1 (Enable the secondary chain.) v. AT!DASCHAN= (Set modem channel) · See Table 8-2 on page 81 for values vi. AT!DASLNAGAIN=0 (Set the LNA to maximum gain.) vii.AT!DAWGAVGAGC=9400,0,1 (The ‘1’ indicates the diversity path is used.) c. Test the limits as in Step 3.
AirPrime Embedded Module Hardware Integration Guide 2. Set up the DUT using the following commands: a. AT!UNLOCK=”” (Unlock extended AT command set.) b. AT!DAFTMACT (Put modem into factory test mode.) c. AT!DAAGCTON (Query power difference between carrier signal and receiver.) 3. Test limits—Run ten or more good DUTs through this test procedure to obtain averaged C/N readings. · The GPS receiver responds to signal levels from -130 dBm to -80 dBm.
Testing c. If using a Sierra Wireless Mini Card Dev Kit, connect the signals as follows: i. Connect the generator output signal to the MIC1_P (positive) and MIC1_N (negative) header pins located at CN18 on the Dev Kit. ii. Connect the analyzer input signal to the SPK1_P (positive) and SPK1_N (negative) header pins located at CN18 on the Dev Kit (see Figure 8-1 on page 85). For additional details concerning use of the Dev Kit, see the PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705). d.
AirPrime Embedded Module Hardware Integration Guide Note: Actual measured results will vary, depending on your testing setup. 3. Take measurements using the following commands (Note that the module has a gain of 4 dB in audio loopback mode.): a. Press the ACV button to measure the AC level. · Expected range: 1–2.5 VAC b. Press the FREQ button to measure the frequency. · Expected value: 1 kHz c. Press the Shift and THD buttons at the same time to measure the total harmonic distortion.
Testing Suggested testing equipment To perform production and post-production tests, you require appropriate testing equipment. Figure 8-2 on page 88 shows a suggested test station for use with devices incorporating AirPrime embedded modules, and Recommended Dev Kit test setup on page 89 shows a supported Dev kit setup. In the test station as shown, a test computer coordinates testing between the host device with an integrated module and the measurement equipment.
AirPrime Embedded Module Hardware Integration Guide Figure 8-2: Recommended production test setup 88 Proprietary and Confidential 2130114
Testing Figure 8-3: Recommended Dev Kit test setup Rev 2.0 Apr.
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A A: Antenna Specification This appendix describes electrical performance criteria for main path, diversity path, and GPS antennas used with AirPrime intelligent embedded modules. Required antennas Table A-1 lists minimum required antenna types for each module and the maximum antenna gain, including cable loss, in a mobile-only exposure condition. Note: If your system uses both the MC8xxx and MC57xx, the five-band antenna can be used for both modules.
AirPrime Embedded Module Hardware Integration Guide Frequency bands Table 1-2 and Table 1-3 summarize the frequency bands that must be supported by main, diversity, and GPS antennas for CDMA and UMTS modules.
Antenna design Design of main path, diversity path, and GPS antennas is determined by the host device OEM and their designated antenna designer. Note: Modems that support diversity and GPS can use the same secondary (diversity) antenna for both. Note: Antennas should be designed before the industrial design is finished to make sure that the best antennas can be developed.
AirPrime Embedded Module Hardware Integration Guide In addition to passing the specific tests described in Testing on page 94, the diversity path antenna should satisfy the following requirement: • Receive performance, measured by forward link throughput, must be 0 to 3 dB better than a single antenna Performance goals When designing the antenna system, consider the following performance goals: • 0 dB gain antenna (or better) • Diversity antenna receive performance to be similar to primary antenna •
• For main and diversity path antennas, make sure the antennas (including contact device, coaxial cable, connectors, and matching circuit with no more than six components, if required) have nominal impedances of 50 across the frequency bands in Table 1-3 on page 92. • All tests (except isolation/correlation coefficient)—Ttest the main or diversity antenna with the other antenna terminated.
AirPrime Embedded Module Hardware Integration Guide Table 1-4: VSWR (Voltage Standing Wave Ratio) (Continued) Frequency (MHz) Typical VSWR Worst-case VSWR at band edges Notes Diversity / GPS antenna 869–894 < 3:1 <3.5:1 925–960 < 3:1 <3.5:1 1930–1990 < 3:1 <3.5:1 2110–2170 < 3:1 <3.5:1 Preferable to have input VSWR < 2:1 Radiated efficiency Table 1-5 details the minimum total radiated efficiency for main and, if supported, diversity antennas.
• Make sure all other wireless devices (Bluetooth or WLAN antennas, etc.) are turned OFF to avoid interference. For details, see Interference from other wireless devices on page 42. Note: System performance below the minimum isolation specification could cause damage to the module, resulting in below-average system performance. Peak gain and radiation patterns Table 1-7 describes the peak and average antenna gain limits for the main path and diversity path antennas.
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B B: Regulatory Information Important notice Because of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
AirPrime Embedded Module Hardware Integration Guide Important compliance information for North American users The MC57xx/MC8xxx modem has been granted modular approval for mobile applications. Integrators may use the MC57xx/MC8xxx modem in their final products without additional FCC/IC (Industry Canada) certification if they meet the following conditions. Otherwise, additional FCC/IC approvals must be obtained. 1.
· For MC8795V: This device contains FCC ID: N7NMC8795 This equipment contains equipment certified under IC: 2417C-MC8795 5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. The end product with an embedded MC57xx/MC8xxx modem may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
AirPrime Embedded Module Hardware Integration Guide Brazil ANATEL homologation (MC8790 somente) Este produto está homologado pela ANATEL, de acordo com os procedimentos regulamentados pela Resolução 242/2000, e atende aos requisitos técnicos aplicados. Para maiores informações, consulte o site da ANATEL www.anatel.gov.br.
C C: MC5728V Important Signal Considerations - Application Note MDL_RESET_N — Module reset input The MDL_RESET_N signal (pin 33) is an input to the MC5728V module from the host device to initiate a reset of the module. When integrating with your host device, keep the following in mind. • This signal is an input to the module and should be driven LOW only for its active state (RESET); otherwise it should be floating or (High impedance). It should never be driven to a logic high level.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide W_Disable# — Wireless disable The W_Disable# signal (pin 20) is an input to the module from the host device to control the Power state (power on and shutdown of the MC5728V module, depending on the state of the signal). When integrating with your host device, keep the following in mind.
D D: Acronyms and Definitions .
AirPrime Embedded Module Hardware Integration Guide Table D-1: Acronyms and definitions Acronym or term 106 Definition MC8201/MC8700/ MC8775/MC8775V / MC8780/MC8781/ MC8790/MC8790V/ MC8791V/MC8792V/ MC8795V Sierra Wireless AirPrime embedded modules used on GSM/UMTS networks MC8xxx Any of the following GSM/UMTS AirPrime embedded modules: MC8201/ MC8700/MC8775/MC8775V/MC8780/MC8781/MC8790/MC8790V/ MC8791V/MC8792V/MC8795V MHz MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second) MIO Module Input/Output M
Index Numerics 1X CDMA Standard, 13 A acceptance tests, 69 acronyms and definitions, 105– 106 airplane mode, 19 anechoic chamber, OTA testing, 43 antenna connection and mounting points, 39 connection considerations, 39 custom, considerations, 40 design requirements, diversity antenna, 93 design requirements, general, 93 design requirements, GPS, 94 design requirements, main antenna, 93 diversity antenna, disabling, 41 diversity, MC57xx, 93 diversity, MC8xxx, 93 frequency bands, supported, 92 GPS, MC57xx /
Document SubTitle communications, host to modem design checklist, 68 connection grounding, 40 connectors, required EDGE mating (52-pin), 12 host-module, 12 RF, Hirose, 12 USIM, 12 current consumption, 26– 36 consumption, usage models, 36 peak inrush current, calculation, 25 specifications, MC57xx, 27– 28 specifications, MC8201, 28– 29 specifications, MC8700, 29– 30 specifications, MC8775/75V, 30– 31 specifications, MC8780/81, 31– 32 specifications, MC8790/90V/91V/92V/95V, 32– 33 specifications, MC8795V, 33
Index interference device generated, 42 power supply noise, 41 wireless devices, 42 isolation test criteria, 96 L LED example, 58 states, 58 low power mode setting, AT commands, 19 setting, CnS commands, 19 state change from normal, temperature, 22 state change from normal, voltage, 21 state change to normal, temperature, 23 state change to normal, voltage, 21 low power, module power state, 19 M MC5727 AT commands, extended, 62 AT reference (extended), 14 AT reference (standard), 13 CnS reference, 13 net
Document SubTitle MC8791V AT reference (extended), 15 AT reference (standard), 14 audio interface, supported, 47 CnS reference, and MC87xx, 14 CnS voice reference, and MC87xxV, 14 current specifications, 32– 33 networks supported, 11 product specification, 14 MC8792V AT reference (extended), 15 AT reference (standard), 14 audio interface, supported, 47 CnS reference, and MC87xx, 14 CnS voice reference, and MC87xxV, 14 current specifications, 32– 33 networks supported, 11 product specification, 14 MC8795V A
Index SED PSD (Product Specification Document), 14 Q quality assurance tests, 86 R regulatory information, 99– 102 Brazil, 102 EU, 101 FCC, 100 limitation of liability, 99 safety and hazards, 99 reset module, input (MC5728V), 103 resistors, external pull-up, 61 resume mode, USB, 57 RF antenna cable loss, maximum, 39 antenna connection, considerations, 39 cable type, required, 12 desense device-generated, 42 harmonic energy, filtering, 43 mitigation suggestions, 43 shielding suggestions, 43 integration,
Document SubTitle 84 certification tests, 70 equipment, suggested, 87 ESD immunity, techniques document (IEC-61000-4-2), 14 GPS receiver, MC8775V, 83 manual functional test, suggested, 71 production tests, 71 quality assurance tests, 86 RF receive path, MC57xx, 79 RF receive path, MC87xx, 81 RF transmission path, MC57xx, 76 RF transmission path, MC87xx, 77 sensitivity, OTA test chamber configuration, 43 suggestions, 69– 89 testing, path loss calculation, 45 thermal considerations, 65– 66 design checklist,
