Specifications

35
Technology Overview
Xserve
Technical Specifications
Hardware
Processing
• Two 2.0GHz, 2.66GHz, or 3.0GHz Dual-Core Intel Xeon 5100 processors featuring:
– Wide Dynamic Execution
– Intelligent Power Capability
– 4MB Advanced Smart Cache per processor
– Smart Memory Access
– Advanced Digital Media Boost
• Independent 1.33GHz frontside bus per processor
Memory
• Advanced 256-bit-wide memory architecture with four fully buffered DIMM (FB-DIMM)
channels featuring:
– ECC (Error Correction Code) logic with on-demand error scrubbing
– CRC (cyclic redundancy check) protection for commands and data
– SDDC (Single Device Data Correction) algorithm
• Eight DIMM slots supporting up to 32GB of 667MHz DDR2 ECC memory using the
following (pairs required; four or eight identical DIMMs recommended for best
performance):
– 512MB FB-DIMMs
– 1GB FB-DIMMs
– 2GB FB-DIMMs
– 4GB FB-DIMMs
I/O connections
• Two open PCI Express expansion slots; one half-length (6.6-inch) x8 PCI Express slot
and one 9-inch configurable slot (x8 PCI Express or 133MHz PCI-X)
• PCI Express and PCI-X cards available from Apple:
– Apple Fibre Channel PCI Express Card
– Apple Dual-Channel Gigabit Ethernet PCI Express Card
– Apple Dual-Channel Ultra320 SCSI PCI-X Card
– ATI Radeon X1300 PCI Express graphics card with 256MB of DDR2 memory and
dual-link DVI port
• Two independent 10/100/1000BASE-T (Gigabit) RJ-45 Ethernet interfaces on main
logic board
• Built-in ATI Radeon X1300 PCI Express graphics board with 64MB of GDDR3 memory
and single-link mini-DVI port; mini-DVI to VGA adapter included
• Two FireWire 800 ports on back panel and one FireWire 400 port on front panel;
15W total power
• Two USB 2.0 ports (480Mb/s each)
• One DB-9 serial port (RS-232)