User Guide

6
BGAREBALLINGWITHSOLDERBALLS
ApplyingSolderballs:
1. SpreadsolderballsontopoftheBGAstencil.
2. Allowexcesssolderballstodropdownviatheslits.Theballscanbe
collectedlaterforreuse.
3. Checkeachholetoensureasolderballispresentineach.
4. ThesolderballswouldsticktotheBGAduetofl uxappliedduringthe
BGAplacementstep.
DetachingtheUpperModule:
1. After allthe holearefilledwithsolderballswemaynowslowlyliftup
theuppermodule.
2. Triggerthetwodisengagementknob.Thencarefullyandslowlylift up
theUppermodule
ReballingwithReflowoven:
1. Cleanupexcessballssurroundingthebga.
2. CarefullyremovetheBGAfromthebottommodule.
3. PlaceBGAinsideareflowovenforreballing.
4. ReflowoventemperatureprofileshouldbeadjustedtofittheBGAto
bereballed.
5. AllowBGAtocooldownbeforehandling.
6. Cleanoffexcessflux.
Excessballscanslipthru
Pulltodisengage
Liftentireuppermodulewithstencil
3
BGACLEANING
After removing BGA from the board it is important that it be thoroughly
cleanedbeforereballing.
Cleaningusingsolderwick
1. AffixBGAtoaflatsurface.
2. ApplyfluxtotheBGA.
3. PlacethedesolderingbraidontopoftheBGA.
4. Heatupthedesolderingbraidusingasolderingiron.
5. GentlyglidetheironanddesolderingbraidontheBGAsurface.
6. Repeatuntilallsolderballsarecleaned.
7. Cleanthefluxresiduewithisopropylalcohol.
8. Inspect and repeat above procedures if BGAs are not thoroughly
cleaned.
Note:DonotexerttoomuchpressureontheBGA,toomuchpressuremay
damagethepadsortheBGAitself.
BGAREBALLINGWITHSOLDERBALLS
Detachinglowermodule:
1. BGAmustfirstbesecuredtothelowermodule.
2. DetachUppermodulefromthelowermodulebypullingforwardthe
twodisengagementknob.ThenliftuptheUppermodule.
Pull
Liftup