User Guide

2
SAFETYPRECAUTIONS
● Whensolderingtemperaturemayreachashighas480°C.
Donotusethedevicenearflammabl ematerials.
Alwaysuseproperequipmentwhenhandlinghotmaterials..
● Solderingprocessproducessmoke—useonwellventilatedplace.
● Chemicalsusedinsolderingmaycauseskinirritation,useproperprotec
tiveequipmentswhenhandlingsuchchemicals.
● When handling material with lead content always follow proper rules
andsafetyguidelines.
TABLEOFCON TENTS
SafetyPrecautions ———————————————– 2
ProductIl lustration————————————————2
BGACleaning———————— ——————————– 3
BGAReballingwithSolderBalls———————– 4—7 
BGAReballingwithSolderPaste———————–7—8
PRODUCTILLUSTRATION
KnobtoDisengage
upperandlower
module
Uppermodule
holdsBGAstencil
Lowermodulehol ds
BGAchip
BGAHolderand
Securinglocks
BGAStencilsecuring
screws
BGAStencilClamp
7
BGAREBALLINGWITHSOLDERBALLS
ReballingwithInfraredsystems:
1. Cleanupexcessballssurroundingthebga.
2. When using infrared systems, it is critical that the temperature ap
pliedtotheBGAbeverysimilartotherecommendedcomponentre
flowprofile.
3. The BGAcan be removed and placed ina preheating system,or di
rectlyreflowedusingtheinfraredgun.
4. AllowBGAtocooldownbeforehandling.
5. Cleanoffexcessflux.
Repeatability:
THEBGAreballingsystemisdesignedtoallowrepeatedreballingofthe
same type component with little to no adjustment of the module. Simply
placethenextBGAtobereballedontotheholder,applyflux,snaponup
permoduleapplysolderballsthenreflow.Thesystemwillproducerepeated
perfectalignmentofballstopadswithnoadditionaladjustments.
BGAREBALLINGWITHSOLDERPASTE
InitialProcedures:
1. FollowBGAcleaningguide.
2. Follow directionas given in “BGA reballing with solder balls: guide.
Exceptdonotaddfluxduring“BGAPlacement”procedure.
3. During“BGAStencil Placement andAdjustment”procedure,thestencil
usedforreballingwithsolderpasteshouldbethickerthatthestencil
usedwithsolderballs.
4. After “BGA Stencil Placement and Adjustment” procedure continue
with“ApplyingSolderpaste“proceduresbelow.
ApplyingSolderpaste:
1. Gentlyspreadanevenamountofsolderpasteintoeveryholeofthe
stencil.
2. Cleanexcesss olderpasteoffthestencil.
3. Triggerthetwodisengagementknob.Slowlydetachtheentireupper
modulefromthebottommodule.