User`s manual

iii
USER’S MANUAL
Models A2541R24A and A2541R24C
Contents
1. Overview .......................................................................................................................................................... 5
1.1. A2541R24A ................................................................................................................................................. 5
1.2. A2541R24C ................................................................................................................................................. 6
1.3. Features....................................................................................................................................................... 6
1.4. Theory of Operation.................................................................................................................................. 7
1.5. Applications ............................................................................................................................................. 10
2. Approvals and Usage ................................................................................................................................... 11
2.1. Product Approvals .................................................................................................................................. 11
2.1.1. USA (Federal Communications Commission, FCC) ......................................................................... 11
2.1.1.1. FCC Labeling Requirements ................................................................................................ 11
2.1.1.2. End User Manual ................................................................................................................... 12
2.1.1.3. RF Exposure ............................................................................................................................ 12
2.1.2. Canada (Industry Canada, IC) .......................................................................................................... 12
2.1.2.1. IC Labeling Requirements .................................................................................................... 14
2.1.2.2. RF Exposure ............................................................................................................................ 16
2.1.3. Europe (Conformité Européenne, ) ............................................................................................... 16
2.1.4. Bluetooth Special Interest Group (SIG) ............................................................................................ 17
2.2. Potential Interference Sources ............................................................................................................... 17
2.2.1. WLAN ............................................................................................................................................... 17
2.2.2. Classic Bluetooth ............................................................................................................................... 18
2.2.3. Microwave ovens ............................................................................................................................... 18
2.2.4. Other Interference ............................................................................................................................. 18
2.2.5. Time critical data ............................................................................................................................... 19
2.3. Approved Usage ..................................................................................................................................... 20
2.3.1. USA and Canada............................................................................................................................... 20
2.3.2. Europe ............................................................................................................................................... 21
2.3.3. Bluetooth ........................................................................................................................................... 21
3. Electrical Characteristics .............................................................................................................................. 22
3.1. Absolute Maximum Ratings .................................................................................................................. 22
3.2. Operating Conditions ............................................................................................................................. 23
3.3. Pin Out ...................................................................................................................................................... 23
3.3.1. A2541R24x10 (Module with TI BLE Stack) ..................................................................................... 23
3.3.2. A2541R24x20 (Module with Emmoco EM-Ware Firmware) ........................................................... 25
3.4. Recommended Layout (dimensions in mm) ....................................................................................... 27
3.5. Power Supply Considerations ............................................................................................................... 29
4. Mechanical and Process ................................................................................................................................ 30
4.1. Radio Module Details (dimensions in mm) ......................................................................................... 30
4.1.1. A2541R24A ...................................................................................................................................... 30
4.1.2. A2541R24C ....................................................................................................................................... 30
4.2. Packaging Details (dimensions in mm) ............................................................................................... 31
4.2.1. Matrix Tray Packaging ..................................................................................................................... 31
4.2.2. Tape-Reel Packaging ......................................................................................................................... 31
4.3. Soldering................................................................................................................................................... 32