Datasheet

SW06
REV. A
–5–
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
SW06BQ –55°C to +125°C Cerdip Q-16
SW06BRC –55°C to +125°C LCC E-20A
SW06FQ –40°C to +85°C Cerdip Q-16
SW06GP –40°C to +85°C Plastic DIP N-16
SW06GS –40°C to +85°C SOL R-16
TRUTH TABLE
Switch State
Disable Logic Channels Channels
Input Input 1 & 2 3 & 4
0 X OFF OFF
1 or NC 0 OFF ON
1 or NC 1 ON OFF
ABSOLUTE MAXIMUM RATINGS
1
Operating Temperature Range
SW06BQ, BRC . . . . . . . . . . . . . . . . . . . –55°C to +125°C
SW06FQ . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
SW06GP, GS . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . +150°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . +36 V
V+ Supply to Ground . . . . . . . . . . . . . . . . . . . . . . . . . +36 V
Logic Input Voltage . . . . . . . . . . . (–4 V or V–) to V+ Supply
Analog Input Voltage Range
Continuous . . . . . . . . . . . . . V– Supply to V+ Supply +20 V
Maximum Current Through
Any Pin Including Switch . . . . . . . . . . . . . . . . . . . . . 30 mA
Package Type u
JA
2
u
JC
Units
16-Pin Hermetic DIP (Q) 100 16 °C/W
16-Pin Plastic DIP (P) 82 39 °C/W
20-Contact LCC (RC) 98 38 °C/W
16-Pin SOL (S) 98 30 °C/W
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA
is specified for worst case mounting conditions, i.e., θ
JA
is specified for device
in socket for Cerdip, P-DIP, and LCC packages; θ
JA
is specified for device soldered
to printed circuit board for SO package.
DICE CHARACTERISTICS
Die Size 0.101 × 0.097 inch, 9797 sq. mils
(2.565 × 2.464 mm, 6320 sq. mm)
PIN CONNECTIONS
16-Pin DIP (Q or P-Suffix)
16-Pin SOL (S-Suffix)
SW06BRC/883
LCC Package
(RC-Suffix)