Datasheet

SSM2211 Data Sheet
Rev. G | Page 22 of 24
OUTLINE DIMENSIONS
Figure 50. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body, S-Suffix
(R-8)
Dimensions shown in millimeters and (inches)
Figure 51. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
SSM2211CPZ-REEL −40°C to +85°C 8-Lead LFCSP CP-8-13 B5A#
SSM2211CPZ-REEL7 −40°C to +85°C 8-Lead LFCSP CP-8-13 B5A#
SSM2211SZ −40°C to +85°C 8-Lead SOIC_N R-8 (S-Suffix)
SSM2211SZ-REEL −40°C to +85°C 8-Lead SOIC_N R-8 (S-Suffix)
SSM2211SZ-REEL7 −40°C to +85°C 8-Lead SOIC_N R-8 (S-Suffix)
1
Z = RoHS Compliant Part; # denotes RoHS compliant product may be top or bottom marked.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8 5
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.55
1.45
1.35
1.84
1.74
1.64
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT
TO JEDEC STANDARDS MO-229-WEED
12-07-2010-A
PIN 1
INDICATOR
(R 0.15)