Datasheet

Data Sheet SSM2211
Rev. G | Page 21 of 24
LFCSP PCB CONSIDERATIONS
The LFCSP is a plastic encapsulated package with a copper lead
frame substrate. The LFCSP is a leadless package with solder lands
on the bottom surface of the package, instead of conventional
formed perimeter leads. A key feature that allows the user to
reach the quoted θ
JA
performance is the exposed die attach
paddle (DAP) on the bottom surface of the package. When
soldered to the PCB, the DAP can provide efficient conduction
of heat from the die to the PCB. To achieve optimum package
performance, consideration must be given to the PCB pad
design for both the solder lands and the DAP. For further
information, see the AN-772 Application Note.