Datasheet

OP1177/OP2177/OP4177
Rev. D | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 36 V
Input Voltage V
S−
to V
S+
Differential Input Voltage ±Supply Voltage
Storage Temperature Range
R, RM, and RU Packages −65°C to +150°C
Operating Temperature Range
OP1177/OP2177/OP4177 −40°C to +125°C
Junction Temperature Range
R, RM, and RU Packages −65°C to +150°C
Lead Temperature, Soldering (10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead MSOP (RM-8)
1
190 44 °C/W
8-Lead SOIC_N (R-8) 158 43 °C/W
14-Lead SOIC_N (R-14) 120 36 °C/W
14-Lead TSSOP (RU-14) 240 43 °C/W
1
MSOP is only available in tape and reel.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.