Datasheet

OP184/OP284/OP484
Rev. J | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage ±18 V
Input Voltage ±18 V
Differential Input Voltage
1
±0.6 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range
P-Suffix, S-Suffix Packages −65°C to +150°C
Operating Temperature Range
OP184/OP284/OP484E/OP484F −40°C to +125°C
Junction Temperature Range
P-Suffix, S-Suffix Packages −65°C to +150°C
Lead Temperature
(Soldering 60 sec)
300°C
1
For input voltages greater than 0.6 V, the input current should be limited to
less than 5 mA to prevent degradation or destruction of the input devices.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply to both DICE and packaged
parts, unless otherwise noted.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions; that is, θ
JA
is
specified for a device in socket for PDIP. θ
JA
is specified for a
device soldered in the circuit board for SOIC packages.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead PDIP (P-Suffix) 103 43 °C/W
8-Lead SOIC (S-Suffix) 158 43 °C/W
14-Lead PDIP (P-Suffix) 83 39 °C/W
14-Lead SOIC (S-Suffix) 92 27 °C/W
ESD CAUTION
R3
Q1
–IN
+IN
QL1
QL2
Q4
Q3
Q2
QB5
QB6
RB2
QB3
R1
Q5
R2
QB4
JB2
QB1
N+CB1
P+M
QB2
CC1
Q9
Q7
Q11
Q8
Q6
Q10
Q12
QB7
QB8
QB9
RB1
JB1
TP
R4
R5
R6
RB3
FFC
R7
R8
Q13
Q14
R10
Q15
RB4
QB10
CC2
C
O
Q17
Q16
R11
Q18
V
CC
OUT
V
EE
R9
00293-004
Figure 4. Simplified Schematic