Datasheet

AD5821A
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to AGND −0.3 V to +5.5 V
V
DD
to DGND −0.3 V to V
DD
+ 0.3 V
AGND to DGND −0.3 V to +0.3 V
SCL, SDA to DGND −0.3 V to V
DD
+ 0.3 V
XSHUTDOWN to DGND −0.3 V to V
DD
+ 0.3 V
I
SINK
to AGND −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −30°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J MAX
) 150°C
WLCSP Power Dissipation (T
J MAX
− T
A
)/θ
JA
θ
JA
Thermal Impedance
1
Mounted on 4-Layer Board 95°C/W
Lead Temperature, Soldering
Maximum Peak Reflow Temperature
2
260°C (±5°C)
1
To achieve the optimum θ
JA
, it is recommended that the AD5821A be
soldered on a 4-layer board.
2
As per JEDEC J-STD-020C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION