Datasheet

AD5821A
Rev. 0 | Page 15 of 16
OUTLINE DIMENSIONS
SEATING
PLANE
0.50 BSC
BALL PITCH
1.575
1.515
1.455
1.750
1.690
1.630
0.28
0.24
0.20
0.35
0.32
0.29
0.65
0.59
0.53
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
123
B
C
BALL 1
IDENTIFIER
091306-B
Figure 27. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD5821ABCBZ-REEL7
1
−30°C to +85°C 9-Ball Wafer Level Chip Scale Package (WLCSP) CB-9-1 1X
AD5821ABCBZ-REEL
1
−30°C to +85°C 9-Ball Wafer Level Chip Scale Package (WLCSP) CB-9-1 1X
AD5821A-WAFER −40°C to +85°C Bare Die Wafer
AD5821AD-WAFER −40°C to +85°C Bare Die Wafer on Film
EVAL-AD5821AEBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.