Datasheet

Data Sheet AD5560
Rev. D | Page 63 of 68
TEMPERATURE CONTOUR MAP ON THE TOP OF THE PACKAGE
TQFP_EP Package
Due to localized heating, temperature at the top surface of
the package has steep gradient. Thus, the θ
JC
value is highly
dependent on where the case temperature is measured.
Figure 61 shows the top of the die temperature contour map
for the TQFP_EP.
BGA Package
Due to localized heating, temperature at the top surface of
the package has steep gradient. Thus, the θ
JC
value is highly
dependent on where the case temperature is measured.
Figure 62 shows the top of the die temperature contour map
for the flip chip BGA.
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Figure 61. Temperature Contour Map for
64-Lead TQFP_EP
07779-065
Figure 62. Temperature Contour Map for the Flip Chip BGA