Datasheet

Data Sheet AD5522
Rev. E | Page 15 of 64
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage, AVDD to AVSS 34 V
AVDD to AGND
−0.3 V to +34 V
AVSS to AGND +0.3 V to −34 V
VREF to AGND −0.3 V to +7 V
DUTGND to AGND AVDD + 0.3 V to AVSS − 0.3 V
REFGND to AGND AVDD + 0.3 V to AVSS − 0.3 V
DVCC to DGND −0.3 V to +7 V
AGND to DGND −0.3 V to +0.3 V
Digital Inputs to DGND −0.3 V to DVCC + 0.3 V
Analog Inputs to AGND AVSS − 0.3 V to AVDD + 0.3 V
Storage Temperature Range −65°C to +125°C
Operating Junction Temperature
Range (J Version)
25°C to 90°C
Reflow Soldering JEDEC Standard (J-STD-020)
Junction Temperature 150°C max
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal resistance values are specified for the worst-case
conditions, that is, a device soldered in a circuit board for
surface-mount packages.
Table 5. Thermal Resistance
1
(JEDEC 4-Layer (1S2P) Board)
Package Type
Airflow
(LFPM) θ
JA
θ
JC
Unit
TQFP Exposed Pad on Bottom
4.8
°C/W
No Heat Sink
2
0 22.3 °C/W
200 17.2 °C/W
500 15.1 °C/W
With Cooling Plate at 45°C
3
N/A
4
5.4 4.8 °C/W
TQFP Exposed Pad on Top 2 °C/W
No Heat Sink
2
0 42.4 °C/W
200 37.2 °C/W
500 35.7 °C/W
With Cooling Plate at 45°C
3
N/A
4
3.0 2 °C/W
1
The information in this section is based on simulated thermal information.
2
These values apply to the package with no heat sink attached. The actual
thermal performance of the package depends on the attached heat sink and
environmental conditions.
3
Natural convection at 55°C ambient. Assumes perfect thermal contact
between the cooling plate and the exposed paddle.
4
N/A means not applicable.
ESD CAUTION