Datasheet

DAC8420
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V, +18.0 V
V
SS
to GND +0.3 V, −18.0 V
V
SS
to V
DD
−0.3 V, +36.0 V
V
SS
to V
VREFLO
−0.3 V, V
SS
− 2.0 V
V
VREFHI
to V
VREFLO
+2.0 V, V
DD
− V
SS
V
VREFHI
to V
DD
+2.0 V, +33.0 V
I
VREFHI
, I
VREFLO
10 mA
Digital Input Voltage to GND −0.3 V, V
DD
+ 0.3 V
Output Short-Circuit Duration Indefinite
Operating Temperature Range
EP, FP, ES, FS, EQ, FQ –40°C to +85°C
Dice Junction Temperature 150°C
Storage Temperature Range –65°C to +150°C
Power Dissipation 1000 mW
Lead Temperature JEDEC Industry Standard
Soldering J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 4.
Package Type θ
JA
θ
JC
Unit
16-Lead PDIP (N) 70
1
27 °C/W
16-Lead CERDIP (Q) 82
1
9 °C/W
16-Lead SOIC (RW) 86
2
22 °C/W
1
θ
JA
is specified for worst case mounting conditions, that is, θ
JA
is specified for
device in socket.
2
θ
JA
is specified for device on board.
ESD CAUTION