Datasheet

DAC08
Rev. C | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Operating Temperature
DAC08AQ, DAC08Q −55°C to +125°C
DAC08HQ, DAC08EQ, DAC08CQ,
DAC08HP, DAC08EP
0°C to +70°C
DAC08CP, DAC08CS −40°C to +85°C
Junction Temperature (T
J
) −65°C to +150°C
Storage Temperature Q Package −65°C to +150°C
Storage Temperature P Package −65°C to +125°C
Lead Temperature (Soldering, 60 sec) 300°C
V+ Supply to V− Supply 36 V
Logic Inputs V− to V− + 36 V
V
LC
V− to V+
Analog Current Outputs (at V
S−
= 15 V) 4.25 mA
Reference Input (V
14
to V
15
) V− to V+
Reference Input Differential Voltage
(V
14
to V
15
) ±18 V
Reference Input Current (I
14
) 5.0 mA
Package Type θ
JA
1
θ
JC
Unit
16-Lead CERDIP (Q) 100 16 °C/W
16-Lead PDIP (P) 82 39 °C/W
20-Terminal LCC (RC) 76 36 °C/W
16-Lead SOIC (S) 111 35 °C/W
1
θ
JA
is specified for worst-case mounting conditions, that is, θ
JA
is specified for
device in socket for CERDIP, PDIP, and LCC packages; θ
JA
is specified for
device soldered to printed circuit board for SOIC package.
Stresses greater than those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.