Datasheet

ADXL345 Data Sheet
LAYOUT AND DESIGN RECOMMENDATIONS
Figure 59 shows the recommended printed wiring board land pattern. Figure 60and Table 24 provide details about the recommended
soldering profile.
3.3400
0.5500
0.2500
3.0500
0.2500
1.1450
5.3400
1.0500
07925-014
Figure 59. Recommended Printed Wiring Board Land Pattern (Dimensions shown in millimeters)
t
P
t
L
t
25°C TO PEAK
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
07925-015
Figure 60. Recommended Soldering Profile
Table 24. Recommended Soldering Profile
1, 2
Condition
Profile Feature Sn63/Pb37 Pb-Free
Average Ramp Rate from Liquid Temperature (T
L
) to Peak Temperature (T
P
) 3°C/sec maximum 3°C/sec maximum
Preheat
Minimum Temperature (T
SMIN
) 100°C 150°C
Maximum Temperature (T
SMAX
) 150°C 200°C
Time from T
SMIN
to T
SMAX
(t
S
) 60 sec to 120 sec 60 sec to 180 sec
T
SMAX
to T
L
Ramp-Up Rate 3°C/sec maximum 3°C/sec maximum
Liquid Temperature (T
L
) 183°C 217°C
Time Maintained Above T
L
(t
L
) 60 sec to 150 sec 60 sec to 150 sec
Peak Temperature (T
P
)
240 + 0/−5°C
260 + 0/−5°C
Time of Actual T
P
− 5°C (t
P
) 10 sec to 30 sec 20 sec to 40 sec
Ramp-Down Rate 6°C/sec maximum 6°C/sec maximum
Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum
1
Based on JEDEC Standard J-STD-020D.1.
2
For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
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