Datasheet

ADXL326
Rev. 0 | Page 14 of 16
OUTLINE DIMENSIONS
112008-A
16
5
13
8
9
12
1
4
0.65 BSC
2.43
1.75 SQ
1.08
1.95 BSC
0.20 MIN
PIN 1
INDICATOR
0.20 MIN
SEATING
PLANE
1.50
1.45
1.40
PIN 1
INDICATOR
COPLANARITY
0.05
0.05 MAX
0.02 NOM
0.35
0.30
0.25
0.55
0.50
0.45
4.15
4.00 SQ
3.85
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
*
STACKED DIE WITH GLASS SEAL.
TOP VIEW
EXPOSED
PAD
(BOTTOM VIEW)
Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_LQ]
4 mm × 4 mm Body, 1.45 mm Thick Quad
(CP-16-5a*)
Dimensions shown in millimeters
ORDERING GUIDE
Model Measurement Range Specified Voltage Temperature Range Package Description Package Option
ADXL326BCPZ
1
±16 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-5a
ADXL326BCPZ–RL
1
±16 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-5a
ADXL326BCPZ–RL7
1
±16 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-5a
EVAL-ADXL326Z
1
Evaluation Board
1
Z = RoHS Compliant Part.
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