Datasheet

ADV7342/ADV7343 Data Sheet
Rev. | Page 20 of 108
ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter
1
Rating
V
AA
to AGND −0.3 V to +3.9 V
V
DD
to DGND −0.3 V to +2.3 V
PV
DD
to PGND −0.3 V to +2.3 V
V
DD_IO
to GND_IO −0.3 V to +3.9 V
AGND to DGND −0.3 V to +0.3 V
AGND to PGND −0.3 V to +0.3 V
AGND to GND_IO −0.3 V to +0.3 V
DGND to PGND −0.3 V to +0.3 V
DGND to GND_IO −0.3 V to +0.3 V
PGND to GND_IO −0.3 V to +0.3 V
Digital Input Voltage to GND_IO −0.3 V to V
DD_IO
+ 0.3 V
Analog Outputs to AGND −0.3 V to V
AA
Maximum CLKIN Input Frequency 80 MHz
Storage Temperature Range (T
S
) −65°C to +150°C
Junction Temperature (T
J
) 150°C
Lead Temperature (Soldering, 10 sec) 260°C
1
Analog output short circuit to any power supply or common can be of an
indefinite duration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The ADV7342/ADV7343 are high performance integrated
circuits with an ESD rating of <1 kV, and they are ESD sensitive.
Proper precautions should be taken for handling and assembly.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance
1
Package Type θ
JA
θ
JC
Unit
64-Lead LQFP 47 11 °C/W
1
Values are based on a JEDEC 4-layer test board.
The ADV7342/ADV7343 are RoHS-compliant, Pb-free products.
The lead finish is 100% pure Sn electroplate. The devices are
suitable for Pb-free applications up to 255°C (±5°C) IR reflow
(JEDEC STD-20).
They are backward compatible with conventional SnPb soldering
processes. The electroplated Sn coating can be soldered with
Sn/Pb solder paste at conventional reflow temperatures of
220°C to 235°C.
ESD CAUTION
D