Datasheet

ADV7188
Rev. A | Page 9 of 112
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
A
VDD
to AGND 4 V
D
VDD
to DGND 2.2 V
P
VDD
to AGND 2.2 V
D
VDDIO
to DGND 4 V
D
VDDIO
to AVDD −0.3 V to +0.3 V
P
VDD
to D
VDD
−0.3 V to +0.3 V
D
VDDIO
to P
VDD
−0.3 V to +2 V
D
VDDIO
to D
VDD
−0.3 V to +2 V
A
VDD
to P
VDD
−0.3 V to +2 V
A
VDD
to D
VDD
−0.3 V to +2 V
Digital Inputs Voltage to DGND −0.3 V to D
VDDIO
+ 0.3 V
Digital Output Voltage to DGND −0.3 V to D
VDDIO
+ 0.3 V
Analog Inputs to AGND AGND − 0.3 V to A
VDD
+ 0.3 V
Maximum Junction Temperature
(T
J
max)
125°C
Storage Temperature Range −65°C to +150°C
Infrared Reflow Soldering (20 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption the user is advised to turn off
any unused ADCs when using the part.
The junction temperature must always stay below the
maximum junction temperature (T
J
max) of 125°C. Use the
following equation to calculate the junction temperature:
T
J
= T
A max
+ (θ
JA
× W
max
)
where:
T
A max
= 85°C.
θ
JA
= 30°C/W.
W
max
= ((A
VDD
× I
AV D D
) + ( D
VDD
× I
DVDD
) + (D
VDDIO
× I
DVDDIO
) +
(P
VDD
× I
PVDD
)).
ESD CAUTION