Datasheet

Data Sheet ADV7181C
Rev. E | Page 9 of 20
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
AVDD to AGND 4 V
DVDD to DGND 2.2 V
PVDD to AGND 2.2 V
DVDDIO to DGND 4 V
DVDDIO to AVDD −0.3 V to +0.3 V
PVDD to DVDD −0.3 V to +0.3 V
DVDDIO to PVDD −0.3 V to +2 V
DVDDIO to DVDD
−0.3 V to +2 V
AVDD to PVDD −0.3 V to +2 V
AVDD to DVDD −0.3 V to +2 V
Digital Inputs Voltage to DGND DGND − 0.3 V to
DVDDIO + 0.3 V
Digital Outputs Voltage to DGND DGND − 0.3 V to
DVDDIO + 0.3 V
Analog Inputs to AGND AGND − 0.3 V to
AVDD + 0.3 V
Operating Temperature Range −40°C to +85°C
Maximum Junction Temperature (T
J MAX
) 125°C
Storage Temperature Range −65°C to +150°C
Infrared Reflow, Soldering (20 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the part, turn off any
unused ADCs.
It is imperative that the recommended scripts be used for the
following high current modes: SCART, 720p, 1080i, and all
RGB graphic standards. Using the recommended scripts ensures
correct thermal performance. These scripts are available from
a local FAE.
The junction temperature must always stay below the maximum
junction temperature (T
J MAX
) of 125°C. The junction temperature
can be calculated by
T
J
= T
A MAX
+ (θ
JA
× W
MAX
)
where:
T
A MAX
= 85°C.
θ
JA
= 45.5° C / W.
W
MAX
= ((AVDD × IAVDD) + (DVDD × IDVDD) +
(DVDDIO × IDVDDIO) + (PVDD × IPVDD)).
THERMAL SPECIFICATIONS
Table 6.
Parameter Test Conditions Value
Junction-to-Case
Thermal Resistance, θ
JC
4-layer PCB with solid
ground plane
9.2°C/W
typical
Junction-to-Ambient
Thermal Resistance, θ
JA
4-layer PCB with solid
ground plane (still air)
45.5°C/W
typical
ESD CAUTION