Datasheet

ADV3226/ADV3227
Rev. 0 | Page 24 of 24
COMPLIANT TO JEDEC STANDARDS MO-220-VRRE.
OUTLINE DIMENSIONS
11.75
BSC SQ
12.00
BSC SQ
1
25
75
51
26
50
100
76
0.25
0.20
0.15
0.50
0.40
0.30
0.70
0.65
0.60
9.60 REF
7.00
6.90 SQ
6.80
PIN 1
INDICATOR
0.20 MIN
0.40
BSC
0.20 REF
0.90
0.85
0.80
0.05 MAX
0.01 NOM
EXPOSED PAD
(BOTTOM VIEW)
PIN 1
INDICATOR
SEATING
PLANE
12° MAX
0.60 M
A
X
0.60 MAX
TOP VIEW
06-11-2008-B
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 66. 100-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
12 mm × 12 mm Body, Very Thin Quad
(CP-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADV3226ACPZ −40°C to +85°C 100-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-100-1
ADV3227ACPZ −40°C to +85°C 100-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-100-1
ADV3226-EVALZ Evaluation Board
ADV3227-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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D08653-0-4/10(0)