Datasheet

ADV3219/ADV3220
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 3.
Parameter Rating
Supply Voltage (V+ − V−) 12 V
Analog Input Voltage V− to V+
Digital Input Voltage 0 to V+
Output Voltage (Disabled Output) (V+ − 1 V) to (V− + 1 V)
Output Short-Circuit
Duration Momentary
Current 50 mA
Temperature
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature 150°C
The ADV3219/ADV3220 are operated with ±5 V supplies and
can drive loads down to 150 , resulting in a wide range of
possible power dissipations. For this reason, extra care must
be taken derating the operating conditions based on ambient
temperature.
Packaged in an 8-lead LFCSP, the ADV3219 and ADV3220
junction-to-ambient thermal impedance (θ
JA
) is 85°C/W. For long-
term reliability, the maximum allowed junction temperature of the
die, T
J
, should not exceed 125°C. Temporarily exceeding this
limit can cause a shift in parametric performance due to a change
in stresses exerted on the die by the package. Figure 2 shows the
range of the allowed internal die power dissipations that meet
these conditions over the −40°C to +85°C ambient temperature
range. When using Figure 2, do not include the external load
power in the maximum power calculation, but do include the
load current through the die output transistors.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.5
0.3
0.6
0.9
1.2
15 25 35 45 55 65 75 85
MAXIMUM POWER (W)
AMBIENT TEMPERATURE (°C)
T
J
= 125°C
08649-002
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead LFCSP 85 23 °C/W
Figure 2. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION