Datasheet

ADV3200/ADV3201
Rev. 0 | Page 7 of 36
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 5.
Parameter Rating
Analog Supply Voltage
(VPOS − VNEG)
7.5 V
Digital Supply Voltage
(DVCC − DGND)
6 V
Ground Potential Difference
(VNEG − DGND)
+0.5 V to −4 V
Maximum Potential Difference
DVCC − VNEG 9.4 V
Disabled Outputs
ADV3200 (|V
OSD
− V
OUT
|) <3 V
ADV3201
(|V
OSD
− (V
OUT
+ VREF)/2|)
<3 V
|VCLAMP − V
INxx
| 6 V
VREF Input Voltage
ADV3200 VPOS − 3.5 V to VNEG + 3.5 V
ADV3201 VPOS − 4 V to VNEG + 4 V
Analog Input Voltage VNEG to VPOS
Digital Input Voltage DVCC
Output Voltage
(Disabled Analog Output)
(VPOS − 1 V) to (VNEG + 1 V)
Output Short-Circuit Duration Momentary
Output Short-Circuit Current 45 mA
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering 10 sec)
300°C
Junction Temperature 150°C
The ADV3200/ADV3201 are operated with ±2.5 V, 5 V, or
±3.3 V supplies and can drive loads down to 150 , resulting in
a large range of possible power dissipations. For this reason,
extra care must be taken to derate the operating conditions
based on ambient temperature.
The ADV3200/ADV3201 are packaged in a 176-lead exposed
pad LQFP. The junction-to-ambient thermal impedance (θ
JA
) of
the ADV3200/ADV3201 is 16°C/W. For long-term reliability,
the maximum allowed junction temperature of the die should
not exceed 150°C. Temporarily exceeding this limit may cause a
shift in parametric performance due to a change in stresses
exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in
device failure. Figure 4 shows the range of allowed internal die
power dissipations that meet these conditions over the −40°C to
+85°C ambient temperature range. When using Figure 4, do not
include external load power in the maximum power calculation,
but do include load current dropped on the die output
transistors.
9
8
7
6
5
4
3
15 25 35 45 55 65 75 85
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER (W)
07176-003
T
J
= 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
ESD CAUTION
Table 6. Thermal Resistance
Package Type θ
JA
Unit
176-Lead LQFP_EP 16 °C/W