Datasheet

ADV3003
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
AVCC to AVEE 3.7 V
VTTI AVCC + 0.6 V
VTTO AVCC + 0.6 V
Internal Power Dissipation 2.0 W
High Speed Input Voltage
AVCC − 1.4 V < V
IN
<
AVCC + 0.6 V
High Speed Differential Input Voltage 2.0 V
Parallel Interface (TX_EN, PE_EN)
AVEE − 0.3 V < V
IN
<
AVCC + 0.6 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a 4-layer JEDEC circuit board for surface-mount
packages.
JC
is specified for the exposed pad soldered to the
circuit board with no airflow.
Table 3.
Package Type θ
JA
θ
JC
Unit
40-Lead LFCSP 31.9 2.6 °C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the ADV3003
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can result
in device failure. To ensure proper operation, it is necessary to
observe the maximum power derating as determined by the
thermal resistance coefficients.
ESD CAUTION