Datasheet

Data Sheet ADuCM360/ADuCM361
Rev. B | Page 23 of 24
OUTLINE DIMENSIONS
112408-B
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WKKD.
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
PIN 1
INDICATOR
7.00
BSC SQ
48
13
24
25
36
37
12
EXPOSED
PAD
PIN 1
INDIC
A
T
OR
5.20
5.10 SQ
5.00
0.45
0.40
0.35
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.25 MIN
0.20 REF
COPLANARITY
0.08
0.30
0.23
0.18
Figure 16. 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
7 mm × 7 mm Body, Very Very Thin Quad
(CP-48-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
ADCs Flash/SRAM Temperature Range Package Description
Package
Option
Ordering
Quantity
ADuCM360BCPZ128 Dual 24-Bit 128 kB/8 kB −40°C to +125°C 48-Lead LFCSP_WQ CP-48-4
ADuCM360BCPZ128-R7 Dual 24-Bit 128 kB/8 kB −40°C to +125°C 48-Lead LFCSP_WQ CP-48-4 750
ADuCM361BCPZ128 Single 24-Bit 128 kB/8 kB −40°C to +125°C 48-Lead LFCSP_WQ CP-48-4
ADuCM361BCPZ128-R7
Single 24-Bit
128 kB/8 kB
−40°C to +125°C
48-Lead LFCSP_WQ
CP-48-4
750
EVAL-ADuCM360QSPZ
ADuCM360 QuickStart Plus
Development System
1
Z = RoHS Compliant Part.