Datasheet

Data Sheet ADuCM360/ADuCM361
Rev. B | Page 17 of 24
ABSOLUTE MAXIMUM RATINGS
Table 14.
Parameter Rating
AVDD to AGND −0.3 V to +3.96 V
IOVDD to DGND
−0.3 V to +3.96 V
Digital Input Voltage to DGND −0.3 V to +3.96 V
Digital Output Voltage to DGND −0.3 V to +3.96 V
Analog Inputs to AGND −0.3 V to +3.96 V
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
150°C
ESD Rating, All Pins
Human Body Model (HBM) ±2.5 kV
Field-Induced Charged Device
Model (FICDM)
±1 kV
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec) 240°C
Pb-Free Assemblies (20 sec to 40 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 15. Thermal Resistance
Package Type θ
JA
Unit
48-Lead LFCSP_WQ 27 °C/W
ESD CAUTION