Datasheet

ADT7411
Rev. B | Page 7 of 36
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range −40°C to +120°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
16-Lead QSOP 150°C
Power Dissipation
1
(T
Jmax
− T
A
)/θ
JA
Thermal Impedance
2
θ
JA
Junction-to-Ambient 105.44°C/W
θ
JC
Junction-to-Case 38.8°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-Up Rate 2°C/sec to 3°C/sec
Ramp-Down Rate −6°C/sec
IR Reflow Soldering (Pb-Free Package)
Peak Temperature 260°C (+0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/sec maximum
Ramp-Down Rate −6°C/sec maximum
Time 25°C to Peak Temperature 8 minutes maximum
1
Values relate to package being used on a 4-layer board.
2
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB-
mounted components.
Table 3. I
2
C Address Selection
ADD Pin I
2
C Address
Low 1001 000
Float 1001 010
High 1001 011
Stresses above those listed under Absolute Maximum Ratings
ma
y cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION